Patents by Inventor Apichart Phaowongsa

Apichart Phaowongsa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7922877
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: April 12, 2011
    Assignee: Utac Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • Publication number: 20100140081
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 10, 2010
    Applicant: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • Patent number: 7718522
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: May 18, 2010
    Assignee: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
  • Patent number: 7572168
    Abstract: A method of singulating semiconductor devices applies a blade to a molded strip that includes the semiconductor device. The blade generates a kerf at a contact point between the blade and the molded strip. The kerf is filled with a plurality of particles. The kerf separates the semiconductor device from the molded strip. The method cools the blade by using a synthetic lubricant. The method lubricates the blade by using the synthetic lubricant. The method rinses the kerf by using the synthetic lubricant. Rinsing the kerf removes a substantial quantity of the particles from the kerf. A system singulates semiconductor devices from a molded strip by using a blade, a temperature control device, and a synthetic lubricant. The blade singulates the semiconductor device from the molded strip. The temperature control device applies the synthetic lubricant to the blade. The synthetic lubricant cools, lubricates, or rinses the blade, or a combination thereof, during a singulation process.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: August 11, 2009
    Assignee: UTAC Thai Limited
    Inventors: Apichart Phaowongsa, Somchai Nondhasitthichai, Charun Sae-lee, Praphan Sararat
  • Publication number: 20080299756
    Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 4, 2008
    Applicant: UTAC Thai Limited
    Inventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa