Patents by Inventor Apor Kerey

Apor Kerey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5089443
    Abstract: A method for making a heat sink device as constructed for use with a semiconductor circuit chip 15. On a thermally conductive substrate a layer of a metal alloy is deposited. The metal alloy is thermally conductive and electrically insulative. Cavities are selectively and controllably formed in the alloy layer to define a plurality of heat dissipation members having heat dissipation surfaces.
    Type: Grant
    Filed: May 30, 1990
    Date of Patent: February 18, 1992
    Assignee: Prime Computer, Inc.
    Inventors: Apor Kerey, Peter Delivorias