Abstract: A multi-chip packaging substrate having a non-sticking test structure consists of a plurality of non-sticking test spots formed in the periphery zone outside the chip-packaging zone of a multi-chip packaging substrate. Each of these non-sticking test spots is electrically connected to an adjacent one of a plurality of chip pads respectively in the chip packaging zone through a plurality of conductive traces while there are no electrical connections connected one another among the chip pads.

Abstract: A crack-preventive substrate for fabricating a solder mask in a device site region includes a substrate, which has a top surface and a bottom surface, and a solder mask layer. The substrate is divided into a device site region and a periphery region. The solder mask layer, disposed on the top surface and bottom surface of the substrate, forms a bare area on the top surface and bottom surface of the substrate by exposing a portion of the substrate on the top surface and bottom surface of the substrate. And the bare areas divide the solder mask layer into a “device site region solder mask layer” and a “periphery region solder mask layer”. As a result, the crack lines generated on the solder mask layer at the perimeter of the substrate will not develop toward the solder mask in the device site region.