Patents by Inventor April Dawn Schricker
April Dawn Schricker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11404608Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.Type: GrantFiled: February 19, 2019Date of Patent: August 2, 2022Assignee: Lumileds LLCInventors: April Dawn Schricker, Kim Kevin Mai, Brendan Jude Moran
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Patent number: 10892385Abstract: Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.Type: GrantFiled: June 6, 2016Date of Patent: January 12, 2021Assignee: LUMILEDS LLCInventors: April Dawn Schricker, Daniel Roitman, Nicolaas Joseph Martin Van Leth
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Publication number: 20190189857Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.Type: ApplicationFiled: February 19, 2019Publication date: June 20, 2019Inventors: April Dawn SCHRICKER, Kim Kevin MAI, Brendan Jude MORAN
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Patent number: 10270013Abstract: In embodiments of the invention, a light emitting device includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A first wavelength converting layer is disposed in a path of light emitted by the light emitting layer. The first wavelength converting layer may be a wavelength converting ceramic. A second wavelength converting layer is fused to the first wavelength converting layer. The second wavelength converting layer may be a wavelength converting material disposed in glass.Type: GrantFiled: August 17, 2017Date of Patent: April 23, 2019Assignee: LUMILEDS LLCInventors: April Dawn Schricker, Oleg Borisovich Shchekin, Han Ho Choi, Peter Josef Schmidt
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Patent number: 10211374Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.Type: GrantFiled: January 2, 2015Date of Patent: February 19, 2019Assignee: LUMILEDS LLCInventors: April Dawn Schricker, Kim Kevin Mai, Brendan Jude Moran
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Patent number: 10205067Abstract: A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element (110) such that the ceramic element (120) is attached to the light emitting element (110), thereby providing an efficient thermal coupling from the red and green converters (330, 120) to the light emitting element (110) and its associated heat sink. To protect the red converter coating (330) from the effects of subsequent processes, a sacrificial clear coating (340) is created above the red converter element (330). This clear coating (340) may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.Type: GrantFiled: June 1, 2016Date of Patent: February 12, 2019Assignee: Lumileds LLCInventors: April Dawn Schricker, Kim Kevin Mai, Grigoriy Basin, Uwe Mackens, Joost Peter Andre Vogels, Aldegonda Lucia Weijers, Karl Adriaan Zijtveld
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Patent number: 10121770Abstract: A device according to embodiments of the invention includes a first semiconductor light emitting layer disposed between a first n-type region and a first p-type region. A second semiconductor light emitting layer disposed between a second n-type region and a second p-type region is disposed over the first semiconductor light emitting layer. A non-III-nitride material separates the first and second light emitting layers.Type: GrantFiled: February 10, 2016Date of Patent: November 6, 2018Assignee: Koninklijke Philips N.V.Inventors: Hans-Helmut Bechtel, Erik Nelson, April Dawn Schricker
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Publication number: 20180159001Abstract: Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.Type: ApplicationFiled: June 6, 2016Publication date: June 7, 2018Applicant: Lumileds LLCInventors: April Dawn SCHRICKER, Daniel ROITMAN, Nicolaas Joseph Martin VAN LETH
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Patent number: 9935244Abstract: A method according to embodiments of the invention includes providing a plurality of LEDs attached to a mount. A filter is attached to at least one of the plurality of LEDs. A protective layer is formed over the filter. A reflective layer is formed over the mount. A portion of the reflective layer disposed over the protective layer is removed.Type: GrantFiled: July 6, 2016Date of Patent: April 3, 2018Assignee: Koninklijke Philips N.V.Inventors: April Dawn Schricker, Hans-Helmut Bechtel, Kim Kevin Mai, Thomas Diederich, Joost Peter Andre Vogels, Uwe Mackens, Matthias Heidemann
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Publication number: 20180068988Abstract: A device according to embodiments of the invention includes a first semiconductor light emitting layer disposed between a first n-type region and a first p-type region. A second semiconductor light emitting layer disposed between a second n-type region and a second p-type region is disposed over the first semiconductor light emitting layer. A non-III-nitride material separates the first and second light emitting layers.Type: ApplicationFiled: February 10, 2016Publication date: March 8, 2018Inventors: Hans-Helmut Bechtel, Erik Nelson, April Dawn Schricker
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Publication number: 20180033923Abstract: In embodiments of the invention, a light emitting device includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A first wavelength converting layer is disposed in a path of light emitted by the light emitting layer. The first wavelength converting layer may be a wavelength converting ceramic. A second wavelength converting layer is fused to the first wavelength converting layer. The second wavelength converting layer may be a wavelength converting material disposed in glass.Type: ApplicationFiled: August 17, 2017Publication date: February 1, 2018Applicant: LUMILEDS LLC.Inventors: April Dawn SCHRICKER, Oleg Borisovich SHCHEKIN, Han Ho CHOI, Peter Josef SCHMIDT
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Publication number: 20170331011Abstract: A method according to embodiments of the invention includes disposing a support layer on a surface of a wavelength converting ceramic wafer. The wavelength converting ceramic wafer and the support layer are diced to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.Type: ApplicationFiled: May 26, 2017Publication date: November 16, 2017Inventors: April Dawn Schricker, Oleg Borisovich Shchekin, Kenneth Vampola, Hans-Helmut Bechtel, Guido Salmaso
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Patent number: 9761768Abstract: In embodiments of the invention, a light emitting device includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A first wavelength converting layer is disposed in a path of light emitted by the light emitting layer. The first wavelength converting layer may be a wavelength converting ceramic. A second wavelength converting layer is fused to the first wavelength converting layer. The second wavelength converting layer may be a wavelength converting material disposed in glass.Type: GrantFiled: July 3, 2014Date of Patent: September 12, 2017Assignee: KONINKLIJKE PHILIPS N.V.Inventors: April Dawn Schricker, Oleg Borisovich Shchekin, Han Ho Choi, Peter Josef Schmidt
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Patent number: 9666771Abstract: A method according to embodiments of the invention includes disposing a support layer (32) on a surface of a wavelength converting ceramic wafer (30). The wavelength converting ceramic wafer and the support layer are diced (42) to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.Type: GrantFiled: January 20, 2015Date of Patent: May 30, 2017Assignee: KONINKLIJKE PHILIPS N.V.Inventors: April Dawn Schricker, Oleg Borisovich Shchekin, Kenneth Vampola, Hans-Helmut Bechtel, Guido Salmaso
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Publication number: 20170012183Abstract: A method according to embodiments of the invention includes disposing a support layer (32) on a surface of a wavelength converting ceramic wafer (30). The wavelength converting ceramic wafer and the support layer are diced (42) to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.Type: ApplicationFiled: January 20, 2015Publication date: January 12, 2017Inventors: April Dawn Schricker, Oleg Borisovich Shchekin, Kenneth Vampola, Hans-Helmut Bechtel, Guido Salmaso
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Patent number: 9543478Abstract: A method according to embodiments of the invention includes providing a plurality of LEDs (60) attached to a mount (62). A filter (102) is attached to at least one of the plurality of LEDs. A protective layer (104) is formed over the filter. A reflective layer (74) is formed over the mount. A portion of the reflective layer disposed over the protective layer is removed.Type: GrantFiled: October 25, 2013Date of Patent: January 10, 2017Assignee: Koninklijke Philips N.V.Inventors: April Dawn Schricker, Hans-Helmut Bechtel, Kim Kevin Mai, Thomas Diederich, Joost Peter Andre Vogels, Uwe Mackens, Matthias Heidemann
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Publication number: 20160365487Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.Type: ApplicationFiled: January 2, 2015Publication date: December 15, 2016Applicant: Koninklijke Philips N.V.Inventors: April Dawn Schricker, Kim Kevin Mai, Brendan Jude Moran
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Publication number: 20160362564Abstract: A composition of electrically conductive composites for temperature sensing comprises conductive particles. The composite forms from a suspension. The suspension comprises the particles and solvent, and the particles are conductive particles with aspect ratio larger than one. The conductive composite retains a negative temperature coefficient when in contact with certain specific surfaces. The particles within the composite self align.Type: ApplicationFiled: January 6, 2014Publication date: December 15, 2016Inventors: Ewa S. Kirkor, April Dawn Schricker
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Publication number: 20160315070Abstract: A method according to embodiments of the invention includes providing a plurality of LEDs attached to a mount. A filter is attached to at least one of the plurality of LEDs. A protective layer is formed over the filter. A reflective layer is formed over the mount. A portion of the reflective layer disposed over the protective layer is removed.Type: ApplicationFiled: July 6, 2016Publication date: October 27, 2016Inventors: April Dawn Schricker, Hans-Helmut Bechtel, Kim Kevin Mai, Thomas Diederich, Joost Peter Andre Vogels, Uwe Mackens, Matthias Heidemann
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Publication number: 20160276551Abstract: A ceramic green wavelength conversion element (120) is coated with a red wavelength conversion material (330) and placed above a blue light emitting element (110) such that the ceramic element (120) is attached to the light emitting element (110), thereby providing an efficient thermal coupling from the red and green converters (330, 120) to the light emitting element (110) and its associated heat sink. To protect the red converter coating (330) from the effects of subsequent processes, a sacrificial clear coating (340) is created above the red converter element (330). This clear coating (340) may be provided as a discrete layer of clear material, or it may be produced by allowing the red converters to settle to the bottom of its suspension material, thereby forming a converter-free upper layer that can be subjected to the subsequent fabrication processes.Type: ApplicationFiled: June 1, 2016Publication date: September 22, 2016Inventors: April Dawn Schricker, Kim Kevin Mai, Grigoriy Basin, Uwe Mackens, Joost Peter Andre Vogels, Aldegonda Lucia Weijers, Karl Adriaan Zijtveld