Patents by Inventor April Lambert

April Lambert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9998100
    Abstract: A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 12, 2018
    Assignee: Ampere Computing LLC
    Inventors: Rich Thaik, Alfred Yeung, April Lambert, Jeremy Plunkett
  • Publication number: 20170063355
    Abstract: A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 2, 2017
    Inventors: Rich Thaik, Alfred Yeung, April Lambert, Jeremy Plunkett