Patents by Inventor Apurva Naik

Apurva Naik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170192028
    Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.
    Type: Application
    Filed: February 13, 2016
    Publication date: July 6, 2017
    Inventors: Richard J. Bond, Vikram Bose-Mullick, Apurva Naik, Joseph Mecca, Richard J. Bond, Vikram Bose-Mullick, Apurva Naik, Joseph Mecca
  • Patent number: 9285351
    Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: March 15, 2016
    Assignee: ANDERSON INSTRUMENT Co., INC.
    Inventors: Richard J. Bond, Vikram Bose-Mullick, Apurva Naik, Joseph Mecca
  • Publication number: 20140350862
    Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.
    Type: Application
    Filed: February 3, 2012
    Publication date: November 27, 2014
    Applicant: ANDERSON INSTRUMENT COMPANY, INC
    Inventors: Richard J. Bond, Vikram Bose-Mullick, Apurva Naik, Joseph Mecca