Abstract: The present invention relates generally to a multi-layered article suitable for service in severe environments. The article may be formed of a substrate, such as silicon carbide and/or silicon nitride. The substrate may have a first layer of a mixture of a rare earth silicate and Cordierite. The substrate may also have a second layer of a rare earth silicate or a mixture of a rare earth silicate and cordierite.

Abstract: The present invention relates generally to a multi-layered article suitable for service in severe environments. The article may be formed of a substrate, such as silicon carbide and/or silicon nitride. The substrate may have a first layer of a mixture of a rare earth silicate and Cordierite. The substrate may also have a second layer of a rare earth silicate or a mixture of a rare earth silicate and cordierite.

Abstract: A processing device includes a plurality of walls defining an interior space configured to be exposed to plasma and a surface coating on the interior surface of at least one of the plurality of walls. The surface coating includes pores forming interconnected porosity. The processing device further includes a sealant residing in at least a portion of the pores of the surface coating. In an embodiment, the sealant can be a thermally cured sealant having a cure temperature not greater than about 100° C. In another embodiment, the sealant can be an epoxy sealant having a viscosity of not greater than 500 cP in liquid precursor form. In yet another embodiment, the sealant can be a low shrinkage sealant characterized by a solidification shrinkage of not greater than 8%.

Abstract: The invention provides new ceramic resistive heating elements and new methods for manufacturing ceramic resistive heating elements wherein the heating element body comprises two or more regions of differing resistivity, and wherein the heating elements are open face. Heating elements such as igniters and glow plugs also are provided obtainable from fabrication methods of the invention.

Abstract: New coaxial ceramic heating elements and methods for manufacture wherein a conductive core region extends into a resistive hot zone at the distal end of the heating element, thereby moving the interface between the core conductive region and the resistive hot zone away from the distal tip of the heating element. Methods comprise bringing together a pre-formed or hardened zone of material with a zone of one or more materials having flow, curing, gelling, drying or otherwise solidifying or hardening the material having flow, and sintering to thereby forming an integral coaxial heating element.

Abstract: New ceramic heating elements are provided that have a recessed portion for receiving an electrical lead. Such ceramic heating elements can provide a reduced cross-sectional dimension across element regions that interface with electrical lead(s) as well as a more secure engagement of an electrical lead. Heating elements can be highly useful in a variety of application, including e.g. for fuel ignition for gas cooking appliances as well as vehicular glow plugs.

Abstract: An electrostatic chuck for supporting a semiconductor wafer, including: a chuck body having a dielectric region and an insulating region, the insulating region having a higher electrical resistivity than the dielectric region, an electrode embedded in the chuck body, and a barrier layer provided between dielectric region and the insulating region.

Abstract: An electrostatic chuck is provided which includes a ceramic body comprising aluminum nitride (AlN), and at least one electrode in the ceramic body. According to a particular feature of this embodiment, the aluminum nitride has a resistivity ratio ?10V/?500V less than about 5. In this regard, ?10V represents the resistivity of the electrostatic chuck at 10 applied volts while ?500V represents the resistivity of the AlN material at 500 applied volts.

Abstract: An electrostatic chuck for supporting a semiconductor wafer, including: a chuck body having a dielectric region and an insulating region, the insulating region having a higher electrical resistivity than the dielectric region, an electrode embedded in the chuck body, and a barrier layer provided between dielectric region and the insulating region.

Abstract: An electrostatic chuck is provided which includes a ceramic body comprising aluminum nitride (AlN), and at least one electrode in the ceramic body. According to a particular feature of this embodiment, the aluminum nitride has a resistivity ratio &rgr;10V/&rgr;500V less than about 5. In this regard, &rgr;10V represents the resistivity of the electrostatic chuck at 10 applied volts while &rgr;500V represents the resistivity of the AlN material at 500 applied volts.