Patents by Inventor Aram Rezikyan

Aram Rezikyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM
    Publication number: 20240140864
    Abstract: In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Hoon Kim, Prantik Mazumder, Aram Rezikyan, Rajesh Vaddi
  • 3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM
    Publication number: 20200148593
    Abstract: In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.
    Type: Application
    Filed: October 29, 2019
    Publication date: May 14, 2020
    Inventors: Hoon Kim, Prantik Mazumder, Aram Rezikyan, Rajesh Vaddi