Patents by Inventor Aram Tanielian

Aram Tanielian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8164154
    Abstract: A low profile high power Schottky barrier bypass diode for solar cells and panels with the cathode and anode electrodes on the same side of the diode and a method of fabrication thereof are disclosed for generating a thin chip with both electrodes being on the same side of the chip. In an embodiment, a mesa isolation with a Zener diode over the annular region surrounding the central region of the mesa anode in the Epi of the substrate is formed. In an embodiment, a P-type Boron dopant layer is ion implanted in the annular region for the Zener Diode. This controls recovery from high voltage spikes from the diode rated voltage. A Schottky barrier contact for the anode and a contact for the cathode are simultaneously created on the same side of the chip.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: April 24, 2012
    Inventors: Aram Tanielian, Garo Tanielian
  • Publication number: 20070077738
    Abstract: A method of fabricating plural bipolar transient voltage suppressors includes preparing a doped base material having a planar surface and then depositing onto the planar surface an doped epitaxial layer of opposite type thereby forming a semiconductor interface. The epitaxial layer is preferentially etched leaving mesas having side walls to the base material. An oxide layer is then deposited all over the upper surface and windows are etched in the oxide layer on the mesas. A high concentration of an appropriate dopant is diffused into the windows to establish ohmic contact surfaces for metallization of conductors. The base material is then bonded onto a substrate and cuts are made through to the base material so as to separate the mesas into adjacent pairs to provide plural bi-polar devices on the substrate.
    Type: Application
    Filed: October 3, 2005
    Publication date: April 5, 2007
    Inventors: Aram Tanielian, Garo Tanielian
  • Patent number: 7114252
    Abstract: A plurality of individual circuits are formed on a substrate. Each of the individual circuits is formed with electrical contacts. A spacer is sealed onto the substrate, the spacer peripherally enclosing each of the individual circuits while exposing the conductive contacts. A cover is positioned over the spacer is and integral with it. First conductive feedthroughs penetrate the cover, the first conductive feedthroughs positioned peripheral to each of the individual circuits. Conductive pads are formed on a bottom surface of the cover, the conductive pads in electrical continuity with the conductive contacts of the individual circuits. Conductive paths are formed on the bottom surface of the cover, the conductive paths each joining at least one of the conductive pads with at least one of the first conductive feedthroughs thereby establishing electrical continuity between the individual circuits and the first conductive feedthroughs so as to establish pin-outs.
    Type: Grant
    Filed: June 17, 2004
    Date of Patent: October 3, 2006
    Assignee: Toko, Inc.
    Inventors: Aram Tanielian, Garo W. Tanielian, Keiichi Nakanishi
  • Publication number: 20060017352
    Abstract: A method of fabricating air-bridge type FBAR devices provides for a piezoelectric material sandwiched between two electrodes with an air/crystal interface on each electrode to trap sound waves within the film structure. Copper is used as a sacrificial material deposited in cavities in the substrate. Following deposition of the electrodes and piezoelectric material, the copper is etched away leaving the bottom electrode suspended over a cavity void.
    Type: Application
    Filed: July 20, 2004
    Publication date: January 26, 2006
    Inventor: Aram Tanielian
  • Publication number: 20050278946
    Abstract: A plurality of individual circuits are formed on a substrate. Each of the individual circuits is formed with electrical contacts. A spacer is sealed onto the substrate, the spacer peripherally enclosing each of the individual circuits while exposing the conductive contacts. A cover is positioned over the spacer is and integral with it. First conductive feedthroughs penetrate the cover, the first conductive feedthroughs positioned peripheral to each of the individual circuits. Conductive pads are formed on a bottom surface of the cover, the conductive pads in electrical continuity with the conductive contacts of the individual circuits. Conductive paths are formed on the bottom surface of the cover, the conductive paths each joining at least one of the conductive pads with at least one of the first conductive feedthroughs thereby establishing electrical continuity between the individual circuits and the first conductive feedthroughs so as to establish pin-outs.
    Type: Application
    Filed: June 17, 2004
    Publication date: December 22, 2005
    Inventors: Aram Tanielian, Garo Tanielian, Keiichi Nakanishi
  • Patent number: 5754044
    Abstract: A magnetooptic device to be used in industrial applications to investigate articles for flaws or defects. The magnetooptic device is capable of revealing defects in articles of nonmagnetic and magnetic conducting material. These results are achieved by designing a magnetooptic device having a magnetooptic transformer element on its bottom surface and incorporating a front electrical contact and a rear electrical contact on the bottom surface of the MO device. The respective electrical contacts are connected by wire conductors to the respective positive and negative terminals of a source of electrical current. The defect pattern of an article can be either visually viewed or the defect pattern can be recorded on a tape or magnetic rubber sheet placed between the bottom surface of the MO device and the top surface of the article being analyzed.
    Type: Grant
    Filed: December 5, 1994
    Date of Patent: May 19, 1998
    Inventors: Aram Tanielian, George D. Carlsen, II, Alexey L. Solodov, Andrey Ya Chervonenkis, Vladimir L. Gribkov, Nikolay N. Kiryuhin
  • Patent number: 5621489
    Abstract: A photosensitive medium, such as motion picture film, having digital audio signals photographically recorded thereon. If the medium has multiple, spatially separated digital and analog audio soundtracks, a photosensitive detector array is employed for each of the digital audio soundtrack areas, and a separate analog soundtrack read head is employed. Preferably, digital error code is recorded in a digital soundtrack area of the medium (with digital audio bits), and error detection and correction are performed on the recorded digital audio bits read from the medium. Preferably, the apparatus includes switching circuitry for substituting a corresponding analog audio signal for one or more corrupted digital soundtrack channels, when such digital soundtrack channels have an error rate which exceeds a selected threshold.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: April 15, 1997
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Michael Kohut, Dana Wood, Paul Wood, Jeff Taylor, Leroy Reese, Aram Tanielian, Jaye M. Waas, Mark Waring, George Carlsen
  • Patent number: 5606264
    Abstract: Seepage of water and other impurities into hermetically sealed on plastic encapsulated modules leads to eventual device failure, as conductor material corrodes and opens, or electromigrates to establish conductive trails across a substrate, shorting the conductors. To forewarn of such failure, a sensing device defined as a separate chip is packaged in the same module with the circuit to be checked, with pinouts that can be tested with a circuit that is usually external. The sensor makes use of the moisture-induced migratory behavior that causes the problem, using a highly migratory metal or alloy to define paired electrodes spaced as closely as 2 micrometers apart. The metal of the electrodes undergoes rapid ionization and migration in the presence of trace amounts of moisture, dissolved ionic contaminants, and a small potential difference across the electrodes.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: February 25, 1997
    Inventors: James J. Licari, Aram Tanielian
  • Patent number: 5473466
    Abstract: A thin transparent epitaxial layer of a magnetizable material (e.g. gallium ferrite) is deposited on a substrate of a dielectric transparent material (e.g. gadolinium gallium garnet). A mask made from an oxidizable material (e.g. silicon) deposited on the epitaxial layer covers pixels defining rows and columns and exposes the other areas on the epitaxial layer. The epitaxial layer is then annealed at a suitable temperature (e.g. 500.degree. C.) for a suitable time (e.g. 10 minutes) to oxidize the silicon and reduce the Fe atoms in the pixel areas beneath the mask to Fe.sup.++ ions. This causes the pixel areas beneath the mask to be more easily magnetizable than the other areas in the epitaxial layer. The mask is then removed and a first insulating layer is deposited on the epitaxial layer. A first plurality of windings is then deposited on the first insulated layer in insulating relationship to one another.
    Type: Grant
    Filed: June 2, 1994
    Date of Patent: December 5, 1995
    Inventors: Aram A. Tanielian, Garo W. Tanielian
  • Patent number: 5453802
    Abstract: A method and apparatus for photographically recording digital audio signals, and a medium having digital audio signals photographically recorded thereon. In a preferred embodiment, a motion picture film recorded in accordance with the invention has multiple digital audio soundtracks and an analog audio soundtrack photographically recorded thereon. Two or more channels of digital audio information can be recorded in each digital soundtrack, along with additional digital information for clocking, tracking, and error detection and correction. Each digital soundtrack is recorded in an array of bit areas arranged in row and column order. In a class of preferred embodiments, each row of digital audio bits is recorded simultaneously by exposing the film to radiation that has been modulated by a linear shutter array. The radiation transmitted by each shutter array is projected onto a row of spots. Each spot covers the full width of one of the bit areas in a row, but only part of the length of the bit area.
    Type: Grant
    Filed: June 10, 1992
    Date of Patent: September 26, 1995
    Assignee: Sony Electronics Inc.
    Inventors: Michael Kohut, Dana Wood, Paul Wood, Jeff Taylor, Leroy Reese, Aram Tanielian, Jaye M. Waas, Mark Waring, George Carlsen
  • Patent number: 5327182
    Abstract: A method and apparatus for reading digital audio signals photographically recorded on a medium (such as motion picture film). If the medium has multiple, spatially separated digital and analog audio soundtracks, a photosensitive detector array is employed for each of the digital audio soundtrack areas, and a separate analog soundtrack read head is employed. Preferably, digital error code is recorded in a digital soundtrack area of the medium (with digital audio bits), and error detection and correction are performed on the recorded digital audio bits read from the medium. Preferably, the apparatus includes switching circuitry for substituting a corresponding analog audio signal for one or more corrupted digital soundtrack channels, when such digital soundtrack channels have an error rate which exceeds a selected threshold.
    Type: Grant
    Filed: June 10, 1992
    Date of Patent: July 5, 1994
    Assignee: Sony Electronics, Inc.
    Inventors: Michael Kohut, Dana Wood, Paul Wood, Jeff Taylor, Leroy Reese, Aram Tanielian, Jaye M. Waas, Mark Waring, George Carlsen
  • Patent number: 5051738
    Abstract: A plurality of semi-conductor diodes disposed in an array may be constructed to emit light when subjected to a particular voltage. This voltage reversely biases the semi-conductor diodes to break down the semi-conductor diodes and to provide for the emission of light upon breakdown. The breakdown occurs at the junction between a pair of electrodes in each semi-conductor diode. One of the electrodes may be an n electrode and the other electrode may be a p electrode. To break down the diode, a positive voltage (e.g. 3-5 volts) may be applied to the n electrode and a ground voltage may be applied to the p electrode. The diodes are so small that an array of 1024.times.1024 diodes can be disposed in a space approximately 0.4" square to act as pixels. The diodes may be scanned, as in a raster scan, preferably on a repetitive basis.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: September 24, 1991
    Assignee: Revtek Inc.
    Inventors: Aram Tanielian, W. Edward Naugler, Jr.