Patents by Inventor Aravind Dugganna NAIK

Aravind Dugganna NAIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11694879
    Abstract: A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidly couples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: July 4, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Ian Widlow, Govinda Raj, Gary U. Keppers, Aravind Dugganna Naik, Francisco Rodarte, Sudhir R. Gondhalekar, Ravikumara Kodinaganhalli
  • Publication number: 20200185202
    Abstract: A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidly couples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system.
    Type: Application
    Filed: October 25, 2019
    Publication date: June 11, 2020
    Inventors: Ian WIDLOW, Govinda RAJ, Gary U. KEPPERS, Aravind Dugganna NAIK, Francisco RODARTE, Sudhir R. GONDHALEKAR, Ravikumara KODINAGANHALLI
  • Patent number: 9770810
    Abstract: A pin clamp assembly has a housing, an actuating device and a movable locating pin. A clamping device is coupled with the actuating device to move within the locator pin. The clamping device includes a rod and a finger. The finger extends and retracts in and out of the locating pin to enable the locating pin and clamping device to be moved so that the clamping finger clamps a workpiece.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: September 26, 2017
    Assignee: DE-STA-CO Europe GmbH
    Inventors: Peter Schauss, Aravind Dugganna Naik, Michael Joanes Chaumet
  • Publication number: 20160129558
    Abstract: A pin clamp assembly has a housing, an actuating device and a movable locating pin. A clamping device is coupled with the actuating device to move within the locator pin. The clamping device includes a rod and a finger. The finger extends and retracts in and out of the locating pin to enable the locating pin and clamping device to be moved so that the clamping finger clamps a workpiece.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 12, 2016
    Inventors: Peter SCHAUSS, Aravind Dugganna NAIK, Michael Joanes CHAUMET