Patents by Inventor ARAVIND MIYAR KAMATH

ARAVIND MIYAR KAMATH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230307211
    Abstract: Process kits for processing chambers and processing chambers having a lower shield and lower shield ring are described. The lower shield has a ring-shaped body with an inner wall and an outer wall, a top wall and a bottom wall with an outer ledge wall extends outwardly from a lower portion of the outer wall to an outer ledge outer wall. The lower shield ring has a ramped lower inner wall with a top face spaced a distance from the bottom face of the upper inner wall so that the distance decreases from the lower inner wall to an inside surface of the outer wall. At least one upper opening extends through the top portion of the lower shield ring and at least one opening extends through the lower portion of the lower shield ring. Upper shields configured to cooperatively interact with the lower shield and lower shield ring are also described.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 28, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Aravind Miyar Kamath, Cheng-Hsiung Matthew Tsai, Manjunatha Koppa
  • Publication number: 20230088552
    Abstract: Magnet assemblies comprising a housing with a top plate each comprising aligned openings are described. The housing has a bottom ring and an annular wall with a plurality of openings formed in the bottom ring. The top plate is on the housing and has a plurality of openings aligned with the plurality of openings in the bottom ring of the housing. The magnet assembly may also include a non-conducting base plate and/or a conductive cover plate. Methods for using the magnet assembly and magnetic field tuning are also described.
    Type: Application
    Filed: September 17, 2021
    Publication date: March 23, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Borui Xia, Anthony Chih-Tung Chan, Shiyu Yue, Wei Lei, Aravind Miyar Kamath, Mukund Sundararajan, Rongjun Wang, Adolph Miller Allen
  • Patent number: 10892180
    Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.
    Type: Grant
    Filed: August 2, 2014
    Date of Patent: January 12, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Bonnie T. Chia, Jallepally Ravi, Manjunatha Koppa, Vinod Konda Purathe, Cheng-Hsiung Matthew Tsai, Aravind Miyar Kamath
  • Patent number: 10134615
    Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: November 20, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Aravind Miyar Kamath, Cheng-Hsiung Tsai, Jallepally Ravi, Tomoharu Matsushita, Yu Chang
  • Publication number: 20160240426
    Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.
    Type: Application
    Filed: February 9, 2016
    Publication date: August 18, 2016
    Inventors: ARAVIND MIYAR KAMATH, CHENG-HSIUNG TSAI, JALLEPALLY RAVI, TOMOHARU MATSUSHITA, YU CHANG
  • Publication number: 20160002778
    Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first plate for supporting a substrate, the first plate having a plurality of purge gas channels on its backside; a second plate disposed beneath and supporting the first plate; and an edge ring surrounding the first plate and disposed above the second plate, wherein the plurality of purge gas channels extend from a single inlet in a central portion to a plurality of outlets at a periphery of the first plate, and wherein the plurality of purge gas channels have a substantially equal flow conductance.
    Type: Application
    Filed: September 3, 2014
    Publication date: January 7, 2016
    Inventors: JALLEPALLY RAVI, TOMOHARU MATSUSHITA, ARAVIND MIYAR KAMATH, XIAOXIONG YUAN, CHENG-HSIUNG MATTHEW TSAI, MANJUNATHA KOPPA
  • Publication number: 20150348823
    Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.
    Type: Application
    Filed: August 2, 2014
    Publication date: December 3, 2015
    Inventors: BONNIE T. CHIA, JALLEPALLY RAVI, MANJUNATHA KOPPA, VINOD KONDA PURATHE, CHENG-HSIUNG MATTHEW TSAI, ARAVIND MIYAR KAMATH