Patents by Inventor Aravindha R. Antoniswamy
Aravindha R. Antoniswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894282Abstract: Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.Type: GrantFiled: June 19, 2019Date of Patent: February 6, 2024Assignee: Intel CorporationInventors: Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu, Junnan Zhao, Ying Wang
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Patent number: 11581240Abstract: An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.Type: GrantFiled: December 21, 2018Date of Patent: February 14, 2023Assignee: Intel CorporationInventors: Kedar Dhane, Omkar Karhade, Aravindha R. Antoniswamy, Divya Mani
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Publication number: 20210125896Abstract: A thermal interface material may be formed comprising a liquid metal and a corrosion resistant filler material. The thermal interface material may be used in an integrated circuit assembly between at least one integrated circuit device and a heat dissipation device, wherein the corrosion resistant filler material changes the physical properties of the thermal interface material, which may prevent failure modes from occurring during the operation of the integrated circuit assembly and may assist in maintaining a bond line thickness between the at least one integrated circuit device and the heat dissipation device.Type: ApplicationFiled: October 24, 2019Publication date: April 29, 2021Applicant: Intel CorporationInventors: Kyle J. Arrington, Aaron Mccann, Kelly Lofgreen, Aravindha R. Antoniswamy, Shankar Devasenathipathy
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Patent number: 10969840Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.Type: GrantFiled: November 16, 2015Date of Patent: April 6, 2021Assignee: Intel CorporationInventors: Aravindha R. Antoniswamy, Syadwad Jain, Zhizhong Tang, Wei Hu
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Publication number: 20210028084Abstract: Embodiments may relate to a microelectronic package that includes a die, a thermal interface material (TIM) coupled with the die, and an integrated heat spreader (IHS) coupled with the TIM. The IHS may include a feature with a non-uniform cross-sectional profile that includes a thin point and a thick point as measured in a direction perpendicular to a face of the die to which the TIM is coupled. Other embodiments may be described or claimed.Type: ApplicationFiled: July 22, 2019Publication date: January 28, 2021Applicant: Intel CorporationInventors: Sergio Antonio Chan Arguedas, Edvin Cetegen, Baris Bicen, Aravindha R. Antoniswamy
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Publication number: 20210020537Abstract: Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A solder thermal interface material (STIM) may be coupled with the die such that the die is between the STIM and the package substrate. An integrated heat spreader (IHS) may be coupled with the STIM such that the STIM is between the IHS and the die, and the IHS may include a feature that is to control bleed-out of the STIM during STIM reflow based on surface tension of the STIM. Other embodiments may be described or claimed.Type: ApplicationFiled: July 19, 2019Publication date: January 21, 2021Applicant: Intel CorporationInventors: Sergio Antonio Chan Arguedas, Manish Dubey, Peng Li, Aravindha R. Antoniswamy, Anup Pancholi
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Publication number: 20200402884Abstract: Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.Type: ApplicationFiled: June 19, 2019Publication date: December 24, 2020Applicant: Intel CorporationInventors: Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu, Junnan Zhao, Ying Wang
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Patent number: 10763188Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.Type: GrantFiled: December 23, 2015Date of Patent: September 1, 2020Assignee: Intel CorporationInventors: Aravindha R. Antoniswamy, Thomas John Fitzgerald, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu, Zhizhong Tang
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Publication number: 20200203254Abstract: An integrated circuit package that includes a liquid phase thermal interface material (TIM) is described. The package may include any number of die. The liquid phase TIM can be sealed in a chamber between a die and an integrated heat spreader and bounded on the sides by a perimeter layer. The liquid phase TIM can be fixed in place or circulated, depending on application. A thermal conductivity of the liquid phase TIM can be at least 15 Watts/meter-Kelvin, according to some embodiments. A liquid phase TIM eliminates failure mechanisms present in solid phase TIMs, such as cracking due to warpage and uncontained flow out of the module.Type: ApplicationFiled: December 21, 2018Publication date: June 25, 2020Applicant: INTEL CORPORATIONInventors: Kedar Dhane, Omkar Karhade, Aravindha R. Antoniswamy, Divya Mani
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Patent number: 10236233Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.Type: GrantFiled: September 21, 2017Date of Patent: March 19, 2019Assignee: Intel CorporationInventors: Aravindha R. Antoniswamy, Thomas J. Fitzgerald
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Publication number: 20190079567Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.Type: ApplicationFiled: November 16, 2015Publication date: March 14, 2019Applicant: Intel CorporationInventors: Aravindha R. Antoniswamy, Syadwad Jain, Zhizhong Tang, Wei Hu
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Publication number: 20190043778Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.Type: ApplicationFiled: December 26, 2015Publication date: February 7, 2019Inventors: Zhizhong TANG, Shinobu KOURAKATA, Kazuo OGATA, Paul R. START, Syadwad JIAN, William Nicholas LABANOK, Wei HU, Peng LI, Douglas R. YOUNG, Gregory S. CONSTABLE, John J. Beatty, Pardeep K. BHATTI, Luke J. GARNER, Aravindha R. ANTONISWAMY
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Publication number: 20190027379Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.Type: ApplicationFiled: November 16, 2015Publication date: January 24, 2019Applicant: Intel CorporationInventors: Wei Hu, Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Nikunj P. Patel, Syadwad Jain, Zhizhong Tang, Shrenik Kothari
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Publication number: 20180012820Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.Type: ApplicationFiled: September 21, 2017Publication date: January 11, 2018Applicant: Intel CorporationInventors: Aravindha R. Antoniswamy, Thomas J. Fitzgerald
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Patent number: 9799584Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.Type: GrantFiled: November 16, 2015Date of Patent: October 24, 2017Assignee: Intel CorporationInventors: Aravindha R. Antoniswamy, Thomas J. Fitzgerald
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Publication number: 20170186628Abstract: Integrated heat spreaders having electromagnetically-formed features, and semiconductor packages incorporating such integrated heat spreaders, are described. In an example, an integrated heat spreader includes a top plate flattened using an electromagnetic forming process. Methods of manufacturing integrated heat spreaders having electromagnetically-formed features are also described.Type: ApplicationFiled: December 23, 2015Publication date: June 29, 2017Inventors: Aravindha R. Antoniswamy, Thomas John Fitzgerald, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu, Zhizhong Tang
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Publication number: 20170141008Abstract: Embodiments of heat spreaders with integrated preforms, and related devices and methods, are disclosed herein. In some embodiments, a heat spreader may include: a frame formed of a metal material, wherein the metal material is a zinc alloy or an aluminum alloy; a preform secured in the frame, wherein the preform has a thermal conductivity higher than a thermal conductivity of the metal material; and a recess having at least one sidewall formed by the frame. The metal material may have an equiaxed grain structure. In some embodiments, the equiaxed grain structure may be formed by squeeze-casting or rheocasting the metal material.Type: ApplicationFiled: November 16, 2015Publication date: May 18, 2017Applicant: Intel CorporationInventors: Aravindha R. Antoniswamy, Thomas J. Fitzgerald
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Patent number: 9330999Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.Type: GrantFiled: June 5, 2014Date of Patent: May 3, 2016Assignee: Intel CorporationInventors: Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Carl L. Deppisch, Nikunj P. Patel
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Publication number: 20150357258Abstract: A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.Type: ApplicationFiled: June 5, 2014Publication date: December 10, 2015Applicant: Intel CorporationInventors: Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Carl L. Deppisch, Nikunj P. Patel