Patents by Inventor Arch Nuttall

Arch Nuttall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for repairing or modifying surface connections on circuit boards
    Patent number: 7199309
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: April 3, 2007
    Assignee: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Structure for repairing or modifying surface connections on circuit boards
    Publication number: 20050239347
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Application
    Filed: June 27, 2005
    Publication date: October 27, 2005
    Applicant: International Business Machines Corporation
    Inventors: Bruce Chamberlin, Mark Hoffmeyer, Wai Ma, Arch Nuttall, James Stack
  • METHOD AND STRUCTURE FOR HEAT SINK ATTACHMENT IN SEMICONDUCTOR DEVICE PACKAGING
    Publication number: 20050174738
    Abstract: A heat sink attachment structure includes an integrated circuit chip mounted on a substrate surface, and a thermal interface layer in contact with the integrated circuit chip. A heat sink is in contact with the thermal interface layer, and at least one spacer member is in contact between the substrate surface and the heat sink, wherein the at least one spacer member is provided with an adhesive material on top and bottom surfaces thereof.
    Type: Application
    Filed: February 6, 2004
    Publication date: August 11, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Roger Lam, Wai Ma, Vincent Montalbano, Arch Nuttall, Nandu Ranadive
  • Method and structure for repairing or modifying surface connections on circuit boards
    Patent number: 6912780
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: July 5, 2005
    Assignee: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Method and structure for repairing or modifying surface connections on circuit boards
    Publication number: 20040216919
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Application
    Filed: June 3, 2004
    Publication date: November 4, 2004
    Applicant: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Method and structure for repairing or modifying surface connections on circuit boards
    Patent number: 6784377
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: August 31, 2004
    Assignee: International Business Machines Corporation
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack
  • Method and structure for repairing or modifying surface connections on circuit boards
    Publication number: 20020179324
    Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.
    Type: Application
    Filed: July 25, 2002
    Publication date: December 5, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bruce John Chamberlin, Mark Kenneth Hoffmeyer, Wai Mon Ma, Arch Nuttall, James R. Stack