Patents by Inventor Archana Devasia

Archana Devasia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Indium bump fabrication on non-planar surface
    Patent number: 12635547
    Abstract: A method is provided for fabricating indium bumps on a non-planar surface defined on a substrate having a base layer and a second layer disposed on a portion of the base layer. Photoresist material is layered on the surface of the substrate but is not in contact with edges of the second layer and regions of the base layer adjacent to the edges of the second layer. Portions of the photoresist material are removed to uncover corresponding portions of the base layer. A shadow mask is positioned on the photoresist material that is on the second layer such that the shadow mask extends over the regions of the base layer adjacent to the edges of the second layer. Indium is deposited on the corresponding portions of the base layer that are uncovered. The shadow mask and the photoresist material are then removed.
    Type: Grant
    Filed: October 20, 2023
    Date of Patent: May 19, 2026
    Assignee: United States of America as represented by the Administrator of NASA
    Inventors: Ari D. Brown, Vilem Mikula, Johannes Staguhn, Archana Devasia