Abstract: An active interposer device includes a multiplexer circuit configurable to provide a first signal from a first integrated circuit to an external terminal of the active interposer device in a first configuration of the active interposer device. The multiplexer circuit is further configurable to provide a second signal from a second integrated circuit to the external terminal in a second configuration of the active interposer device. The second integrated circuit is larger than the first integrated circuit, and the active interposer device is configurable to couple the first integrated circuit or the second integrated circuit to a package substrate through the external terminal.

Abstract: Systems or methods of the present disclosure may provide for implementing design software that is used to design a configuration for a programmable fabric of a programmable logic device. Implementing the design software includes receiving, at a processor, design configuration details for the configuration. Implementing the design software also includes receiving, at the processor, a plurality of constraints including a thermal constraint for the configuration. Moreover, implementing the design software comprises performing thermal aware resource selection based at least in part on the thermal constraint. Furthermore, implementing the design software includes causing the programmable logic device to be operated to stay within the thermal constraint.

Abstract: An integrated circuit package includes a first integrated circuit die, a spacer die coupled in the integrated circuit package in a location designed to house a second integrated circuit die, and a package substrate coupled to the first integrated circuit die and to the spacer die.

Abstract: A three dimensional circuit system includes first and second integrated circuit (IC) dies. The first IC die includes programmable logic circuits arranged in sectors and first programmable interconnection circuits having first router circuits. The second IC die includes non-programmable circuits arranged in regions and second programmable interconnection circuits having second router circuits. Each of the regions in the second IC die is vertically aligned with at least one of the sectors in the first IC die. Each of the second router circuits is coupled to one of the first router circuits through a vertical die-to-die connection. The first and second programmable interconnection circuits are programmable to route signals between the programmable logic circuits and the non-programmable circuits through the first and second router circuits. The circuit system may include additional IC dies. The first and second IC dies and any additional IC dies are coupled in a vertically stacked configuration.

Abstract: Systems or methods of the present disclosure may provide for determining a load line for operation of a programmable logic fabric where the load line is based at least in part on design configuration details for a design or a configuration rather for generic deployment of the programmable logic device. The load line may be determined using software modeling for the design or configuration. Additionally or alternatively, the load line may be determined using runtime testing and sensing of real-world parameters. This determination based on real-world parameters of a deployment of the configuration or design is based on a determination of a step load for the design or configuration.

Abstract: An integrated circuit system includes a temperature sensor circuit that generates an output indicative of a temperature in an integrated circuit. The integrated circuit system also includes a temperature management controller circuit that compares the temperature indicated by the output of the temperature sensor circuit to a temperature threshold. The integrated circuit system further includes temperature reduction circuitry and/or design compilation techniques and partial or full reconfiguration that controls the temperature in the integrated circuit system. The temperature management controller circuit causes the temperature reduction circuitry to reduce the temperature in response to the temperature indicated by the output of the temperature sensor circuit exceeding the temperature threshold. The temperature sensor circuit, the temperature management controller circuit, and the temperature reduction circuitry may be implemented by soft logic circuits, hard logic circuits, or any combination thereof.

Abstract: An integrated circuit includes a first input/output lane comprising first external terminals and first driver circuits. The first driver circuits exchange signals with a first external device through the first external terminals as part of a first external interface. The first input/output lane is part of a sub-bank in an input/output bank that implements at least a part of the first external interface. The integrated circuit includes a second input/output lane comprising second external terminals and second driver circuits. The second driver circuits exchange signals with a second external device through the second external terminals as part of a second external interface. The second input/output lane is part of the sub-bank in the input/output bank that implements at least a part of the second external interface.

Abstract: Systems and methods are provided for generating a circuit design for an integrated circuit using a circuit design tool. The circuit design tool determines maximum junction temperatures for circuit blocks in the circuit design for the integrated circuit. The circuit design tool determines defects values for the circuit blocks using the maximum junction temperatures for the circuit blocks. The circuit design tool determines a defects value for the circuit design based on the defects values for the circuit blocks. The circuit design tool determines a maximum junction temperature for the circuit design based on a comparison between the defects value for the circuit design and a target defects value for the circuit design. The circuit design tool can dynamically reconfigure configurable logic circuit blocks to improve the power, the performance, and the thermal profile to achieve an optimal junction temperature per circuit block.

Abstract: A three dimensional circuit system includes first and second integrated circuit (IC) dies. The first IC die includes programmable logic circuits arranged in sectors and first programmable interconnection circuits having first router circuits. The second IC die includes non-programmable circuits arranged in regions and second programmable interconnection circuits having second router circuits. Each of the regions in the second IC die is vertically aligned with at least one of the sectors in the first IC die. Each of the second router circuits is coupled to one of the first router circuits through a vertical die-to-die connection. The first and second programmable interconnection circuits are programmable to route signals between the programmable logic circuits and the non-programmable circuits through the first and second router circuits. The circuit system may include additional IC dies. The first and second IC dies and any additional IC dies are coupled in a vertically stacked configuration.

Abstract: A circuit system includes a first voltage regulator circuit that generates a first supply voltage for an integrated circuit die based on a first control signal. The first voltage regulator circuit generates a first feedback signal based on the first supply voltage. The circuit system also includes a second voltage regulator circuit that generates a second supply voltage for an integrated circuit die based on a second control signal. The second voltage regulator circuit generates a second feedback signal based on the second supply voltage. The circuit system also includes a third voltage regulator circuit that generates the first control signal based on the first feedback signal and the second control signal based on the second feedback signal. The circuit system may include fully integrated, on-board, and on-package voltage regulator circuits.

Abstract: A circuit system includes a first integrated circuit die having a first group of circuits configured to perform a first set of operations. The circuit system also includes a second integrated circuit die having a second group of circuits configured to start performing a second set of operations with a delay after the first group of circuits starts performing the first set of operations to reduce power supply voltage droop. The operations performed by the first and second groups of circuits can be interleaved with a fixed or a variable delay. Logic circuits can be partitioned into the first and the second groups of circuits based on predicted switching activity of the logic circuits. Decoupling capacitors in integrated circuit dies can be coupled together to reduce droop in a supply voltage during a high current event.

Abstract: A circuit system includes a power control circuit that generates multiple voltage identifiers. Multiple voltage regulator circuits generate multiple supply voltages based on the voltage identifiers. The supply voltages are provided to multiple integrated circuit dies. The power control circuit varies the voltage identifiers based on changes in metrics associated with the integrated circuit dies to cause the voltage regulator circuits to vary the supply voltages. Integrated circuit dies receive supply voltages from voltage regulator circuits through power delivery networks. The integrated circuit dies provide voltage sense signals that indicates the supply voltages. The voltage regulator circuits adjust the supply voltages based on the voltage sense signals to compensate for voltage drops in the power delivery networks.

Abstract: An electronic system includes first, second, third, and fourth integrated circuit dies. The third integrated circuit die has a first voltage regulator circuit. A supply voltage output of the first voltage regulator circuit is coupled to provide a first supply voltage to a supply voltage input of the first integrated circuit die. The first voltage regulator circuit generates a first power ready signal that indicates when the first supply voltage has reached a first threshold voltage. The fourth integrated circuit die has a second voltage regulator circuit that generates a second supply voltage in response to the first power ready signal. A supply voltage output of the second voltage regulator circuit is coupled to provide the second supply voltage to a supply voltage input of the second integrated circuit die.

Abstract: An integrated circuit configured to execute multiple operations in parallel is provided. The integrated circuit may be organized into multiple logic sectors. Two or more groups of logic sectors may be executed in an interleaved fashion, where successive groups of logic sectors are activated after a predetermined amount of delay. The integrated circuit may include an array of memory cells. Rows of the memory cells may be accessed in an interleaving manner, where successive rows of memory cells are selected after a predetermined amount of delay. Operating groups of circuit components using an interleaving scheme can help improve operational efficiency while reducing power supply noise without having to increase die area for on-die decoupling capacitance.

Abstract: An integrated circuit configured to execute multiple operations in parallel is provided. The integrated circuit may be organized into multiple logic sectors. Two or more groups of logic sectors may be executed in an interleaved fashion, where successive groups of logic sectors are activated after a predetermined amount of delay. The integrated circuit may include an array of memory cells. Rows of the memory cells may be accessed in an interleaving manner, where successive rows of memory cells are selected after a predetermined amount of delay. Operating groups of circuit components using an interleaving scheme can help improve operational efficiency while reducing power supply noise without having to increase die area for on-die decoupling capacitance.