Abstract: A system for cooling an electronic component includes an enclosure, a radiator, a pump, a valve, and a tubing network. The enclosure is configured to house the electronic component and to permit a fluid to directly contact the electronic component. The valve selectively permits passage of the fluid to the pump. The tubing network circulates a fluid from the enclosure to at least one of the radiator, the valve, or the pump.

Abstract: A thermopile sensor including a uniform substrate having a first surface with a first section and a second section at an elevation varying relative to the first section by between about 5 micrometers and about 500 micrometers. The sensor further includes a plurality of thermopile junctions, with each junction having (i) a first strip of a first conductive material, extending from the first section to the second section, (ii) a second strip of a second conductive material, forming an electrical junction with the first strip on the second section and extending to the first section, and (iii) with the thermopile junctions being connected in series. A first contact pad on the substrate is connected to an initial thermopile junction and a second contact pad on the substrate is connected to a last thermopile junction, with conductors connecting to the first and second contact pads and extending off of the substrate.