Abstract: The invention provides means by which access to the intracranial compartment is completely sealed from the skin and the scalp tissues, which makes it possible to change the drain when necessary without bringing the drain in the contact with the scalp. It also provides an improved ventricle draining system supporting a better fixation of the drain to avoid the drain from sliding. The drain comprises a fixture with a conduit defining passage through the fixture, the fixture being provided with fastening means for attachment of the fixture to an aperture in the cranial bone, a seal for sealed engagement with a catheter inserted in the fixture, and fastener for securing the catheter to the fixture.

Abstract: A flip chip having a chip passivation layer disposed on a metalization layer. Terminal vias are formed in the passivation layer exposing a portion of the metalization layer and terminal metalization is disposed on the metalization layer at the terminal vias. A stress reducing layer is disposed on the chip passivation layer with underfill apertures formed in the stress reducing layer so as to expose selected portions of the chip passivation layer, thereby enhancing the adhesion of an underfill material to the flip chip.

Abstract: A tool head attachment is disclosed for use with a farm or other industrial equipment, such as a bobcat or a four-wheeler. Extending from a frame mounted on the vehicle or equipment is a beam attached to self-leveling mechanism. The beam meets at an angle on a rotatable assembly from which another beam extends. The rotatable assembly allows up to full rotation of one beam about the other beam for storage. At or near the rotatable assembly is a safety break away mechanism which causes the beams to separate when a major obstacle is encountered. The other beam extending from the rotatable assembly is attached to a self-articulating and self-leveling assembly to which a tool head is mounted. The self-articulating and self-leveling assembly maintains the tool head a relative distance from or into the surface of the ground and easily deflects upon encountering a minor obstacle without interruption of operation. Different tool heads may include tillers, harvesters, cutters, etc.

Abstract: A cerebrospinal fluid shunt system comprises a brain ventricular catheter for insertion into the brain ventricle so as to drain cerebrospinal fluid from the brain ventricle. The system also comprises a sinus sagittalis catheter for insertion into the sinus sagittalis for feeding the cerebrospinal fluid into sinus sagittalis. A shunt main body is connected at one end thereof to the brain ventricle catheter and at another end thereof to the sinus sagittalis catheter. The shunt main body can provide fluidic communication between the brain ventricle catheter and the sinus sagittalis catheter. The system further comprises a tubular flow passage restricting member defines within the shunt main body. The tubular flow passage restricting member defines a resistance to flow of 8-12 mm Hg/ml/min.

Abstract: A ventricle drain includes a sealing structure for providing a sealed passage through an aperture in a cranial bone. The ventricle drain also includes a catheter having a free end and an end adapted for insertion into the aperture through the sealed passage for draining bodily fluids. The sealing structure includes a fixture with a conduit defining a passage through the fixture, a seal for sealed engagement with the catheter and the fixture, and a fastener for securing the catheter to the fixture. The fixture is provided with a fastening structure for attachment of the fixture to the aperture.

Abstract: A cerebrospinal fluid shunt system comprises a brain ventricle catheter (15) to insert into the brain ventricle (21) so as to drain cerebrospinal fluid from the brain ventricle, a sinus catheter (18) to insert into the sinus sagittalis system (22) for feeding the cerebrospinal fluid into the sinus sagittalis system, a shunt body member (10) connected at one end thereof to said brain ventricle catheter and at another end thereof to said sinus catheter system to provide fluidic communication between said brain ventricle catheter (15) and said sinus catheter (18), and a flow restriction (16) defined within the shunt body member (10) to maintain a resistance to fluid flow of the shunt system of less than 8 mm Hg/ml/min, such as 2-7 or 4-6 and preferably about 5 mm Hg/ml/min. When the shunt system is implanted the shunt body member (10) is placed subcutaneously on top of the calvarium of a patient, behind the coronal suture on one of side of the sagittal suture.

Abstract: A component package having a substrate. The substrate has a component or chip section and a separate assembly section. An array of component pads are disposed on the component section and are adapted to be electrically connected to a component. An array of assembly contact pads are disposed on the assembly section and are adapted to be connected to a next level assembly, such as a printed circuit board. The component contact pads are electrically connected to the assembly contact pads by electrical conductors affixed to the substrate. At least a portion of the substrate between the component section and the assembly section is flexible. The assembly section of the substrate can be secured to a rigid carrier and a casing (or overmolded top) can be mounted to the rigid carrier so as to protect a component enclosed in the package.

Abstract: A cerebrospinal fluid shunt system comprises a brain ventricular catheter for insertion into the brain ventricle so as to drain cerebrospinal fluid from the brain ventricle. The system also comprises a sinus sagittalis catheter for insertion into the sinus sagittalis for feeding the cerebrospinal fluid into sinus sagittalis. A shunt main body is connected at one end thereof to the brain ventricle catheter and at another end thereof to the sinus sagittalis catheter. The shunt main body can provide fluidic communication between the brain ventricle catheter and the sinus sagittalis catheter. The system further comprises a tubular flow passage restricting member defined within the shunt main body. The tubular flow passage restricting member defines a resistance to flow of 8-12 mm Hg/ml/min.

Abstract: A multiple layer interconnect structure for a semiconductor chip includes a graded transition layer of tungsten and a Group VIII metal, such as palladium, platinum or nickel (Pd, Pt or Ni) which allows formation of a Group VIII metal interconnect on a conventional pad of Al or Al alloy. The graded transition layer is interfaced between a thin adhesion layer on the pad and the Group VIII metal interconnect, and is approximately 100% tungsten where it interfaces the adhesion layer and approximately 100% Group VIII metal where it interfaces the interconnect layer. The tungsten in the graded transition layer acts as a solder barrier and the Group VIII metal interconnect is compatible with the silicon substrate so that packaging processing steps, including lead soldering, can be carried out, and the chip electrically tested, in the semiconductor fabrication facility.

Abstract: Interconnect or metallization structures for integrated circuits on semiconductor chips contain blocked conductor segments to limit atomic transport from one segment to another thus minimizing stress migration and electromigration damage. Since the blocked conductor segments prevent atomic transport between two neighboring segments, the total amount of atoms and vacancies available for hillock and void growth in a segment can be controlled by the length of the segment. The conductor segments are made of high electrical conductance metals, such as aluminum, copper or gold based alloys, and are separated by very short segments of a high melting temperature refractory metal or alloy. Because of their high melting temperatures, refractory metals or alloys suppress atomic transport. The interconnect structures can be fabricated by conventional lithographic and deposition techniques.