Patents by Inventor Argo Chang

Argo Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having improved thermal performance
    Patent number: 7612439
    Abstract: A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: November 3, 2009
    Assignee: Alpha and Omega Semiconductor Limited
    Inventors: Xiaotian Zhang, Argo Chang, James Lee, Ryan Huang, Kai Liu, Ming Sun
  • Semiconductor package having improved thermal performance
    Publication number: 20070145609
    Abstract: A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.
    Type: Application
    Filed: December 22, 2005
    Publication date: June 28, 2007
    Inventors: Xiaotian Zhang, Argo Chang, James Lee, Ryan Huang, Kai Liu