Patents by Inventor Ari Brown

Ari Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Indium bump liftoff process on micro-machined silicon substrates
    Patent number: 10923446
    Abstract: A metallic etching process includes applying an anti-reflection coating over a metallic superstrate, applying a dry film photoresist over the anti-reflection coating, removing exposed portions of the dry film photoresist exposing a portion of the anti-reflection coating, etching the exposed portions of the anti-reflection coating exposing portions of the metal superstrate, etching portions of the metallic superstrate not covered by the dry film photoresist, and removing the dry film photoresist and the anti-reflection coating leaving portions of the metallic superstrate. An indium bump liftoff process includes applying a positive photoresist, forming a liftoff mask by applying a dry film photoresist over the positive photoresist, removing exposed portions of the liftoff mask to expose a portion of a substrate, depositing an indium film over the exposed portion of the substrate and remaining portions of the liftoff mask, and removing remaining portions of the liftoff mask.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: February 16, 2021
    Assignee: United States of America as represented by the Administrator of NASA
    Inventors: Ari Brown, Vilem Mikula