Abstract: An improved belt separator system and an improved method to separate particle mixtures based on triboelectric separation of particles is disclosed. The separator system includes a tensioning system embodying a tension roller and a two-part rotating shaft assembly.

Abstract: A sample processing apparatus includes a sample carrier receiving region configured to receive a sample carrier. The sample carrier includes at least one sample channel carrying at least one sample, at least one agent chamber carrying at least one agent to be moved to the at least one sample channel to facilitate processing of the at least one sample, and the at least one agent chamber includes at least one chamber cover covering at least one opening of the at least one agent chamber, inhibiting flow of the at least one agent from the at least one agent chamber to the at least one sample channel. The sample processing apparatus further includes a chamber opener configured to facilitate opening the at least one chamber cover. The sample processing apparatus further includes a fluid mover that moves the agent out of the at least one agent chamber after the at least one chamber cover is opened and into the at least one sample channel.

Abstract: A sample processing apparatus includes a sample carrier receiving region configured to receive sample carrier carrying one or more samples for processing by the sample processing apparatus, and a thermal control system that controls a thermal cycling of the one or more samples for processing by the sample processing apparatus by selectively varying a pressure over a fluid in substantial thermal communication with the sample carrier, thereby varying a boiling point temperature of the fluid.

Abstract: A micro channel device includes at least one sample processing region (108) that supports a sample for processing by a sample processing apparatus, at least one chamber (120, 126) that stores a fluid, at least one channel (202, 204, 206, 302, 402), and an interface (116) configured to interface with the processing apparatus. Moisture removed from compressed air, which is employed to move the sample and/or a processing agent through the at least one channel, is received by the interface and routed via the at least one channel to the at least one chamber.

Abstract: A sample processing apparatus includes a sample carrier receiving region configured to receive a sample carrier. The sample carrier includes at least one sample channel carrying at least one sample, at least one agent chamber carrying at least one agent to be moved to the at least one sample channel to facilitate processing of the at least one sample, and the at least one agent chamber includes at least one chamber cover covering at least one opening of the at least one agent chamber, inhibiting flow of the at least one agent from the at least one agent chamber to the at least one sample channel. The sample processing apparatus further includes a chamber opener configured to facilitate opening the at least one chamber cover. The sample processing apparatus further includes a fluid mover that moves the agent out of the at least one agent chamber after the at least one chamber cover is opened and into the at least one sample channel.

Abstract: A sample processing apparatus includes a sample carrier receiving region configured to receive sample carrier carrying one or more samples for processing by the sample processing apparatus, and a thermal control system that controls a thermal cycling of the one or more samples for processing by the sample processing apparatus by selectively varying a pressure over a fluid in substantial thermal communication with the sample carrier, thereby varying a boiling point temperature of the fluid.

Abstract: An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.

Abstract: An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.

Abstract: An ion implantation apparatus, system, and method are provided for connecting and disconnecting a workpiece holder from a scan arm. A twist head is provided, wherein an electrostatic chuck is operable to be mounted, wherein one or more rotating and non-rotating members associated with one or more of the twist head and electrostatic chuck have one or more dynamic electrical and fluid rotary connections associated therewith. The electrostatic chuck is further operable to be removed from the twist head without disconnecting the one or more dynamic fluid seals.

Abstract: An ion implantation apparatus, system, and method are provided for connecting and disconnecting a workpiece holder from a scan arm. A twist head is provided, wherein an electrostatic chuck is operable to be mounted, wherein one or more rotating and non-rotating members associated with one or more of the twist head and electrostatic chuck have one or more dynamic electrical and fluid rotary connections associated therewith. The electrostatic chuck is further operable to be removed from the twist head without disconnecting the one or more dynamic fluid seals.

Abstract: A vertical rapid thermal processing system includes a processing chamber and an elevator structure providing for vertical movement of a workpiece within the processing chamber. The elevator structure includes a workpiece support for supporting the workpiece and an elevator shaft coupled to the workpiece support and extending externally from the processing chamber. An end portion of the elevator shaft, external to the processing chamber, has a selected magnetic polarity. The elevator structure also includes moveable carriage coupled to the shaft to provide vertical movement of the workpiece within the processing chamber. The carriage includes a shaft support having the selected polarity. The shaft support is positioned adjacent the polarized end portion of the elevator shaft such that repulsive magnetic forces maintain a gap between the end portion of the elevator shaft and the shaft support as the shaft support and elevator shaft move vertically along a path of travel.

Abstract: A workpiece is supported on a gas cushion to reduce mechanical stresses on the workpiece during processing. A plenum having a workpiece support flange for receiving the workpiece is connected to a gas supply. When gas flows into the plenum and pressure increases sufficiently to lift the workpiece, the workpiece is lifted and the gas flows out of the plenum between the flange and the workpiece edge. The workpiece is thus supported above the flange by the gas during processing.

Abstract: A wafer support position control mechanism selectively positions a semiconductor wafer along an axis of excursion within a process chamber. An elevator tube protrudes through an orifice in the chamber surface and is connected at a first distal end to the wafer support. A compliant, dynamic seal within the orifice engages the elevator tube to form a gas curtain within a gap between the seal and the elevator tube to seal the process chamber. A moveable carriage is connected to the elevator tube at a second distal end for moving the wafer support along the axis of excursion. Rigid mechanical structure couples the second distal end of the elevator tube to the moveable carriage.

Abstract: A vertical rapid thermal processing system includes a processing chamber and an elevator structure providing for vertical movement of a workpiece within the processing chamber. The elevator structure includes a workpiece support for supporting the workpiece and an elevator shaft coupled to the workpiece support and extending externally from the processing chamber. An end portion of the elevator shaft, external to the processing chamber, has a selected magnetic polarity. The elevator structure also includes moveable carriage coupled to the shaft to provide vertical movement of the workpiece within the processing chamber. The carriage includes a shaft support having the selected polarity. The shaft support is positioned adjacent the polarized end portion of the elevator shaft such that repulsive magnetic forces maintain a gap between the end portion of the elevator shaft and the shaft support as the shaft support and elevator shaft move vertically along a path of travel.

Abstract: A wafer support position control mechanism selectively positions a semiconductor wafer along an axis of excursion within a process chamber. An elevator tube protrudes through an orifice in the chamber surface and is connected at a first distal end to the wafer support. A compliant, dynamic seal within the orifice engages the elevator tube to form a gas curtain within a gap between the seal and the elevator tube to seal the process chamber. A moveable carriage is connected to the elevator tube at a second distal end for moving the wafer support along the axis of excursion. Rigid mechanical structure couples the second distal end of the elevator tube to the moveable carriage.

Abstract: A workpiece is supported on a gas cushion to reduce mechanical stresses on the workpiece during processing. A plenum having a workpiece support flange for receiving the workpiece is connected to a gas supply. When gas flows into the plenum and pressure increases sufficiently to lift the workpiece, the workpiece is lifted and the gas flows out of the plenum between the flange and the workpiece edge. The workpiece is thus supported above the flange by the gas during processing.