Patents by Inventor Arie Frenklakh

Arie Frenklakh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FRAUD PREVENTION AND TRACKING A COMMUNICATION PATH WITH SMART CONTRACTS
    Publication number: 20220294768
    Abstract: A method for tracking communication, comprising: receiving a notification pertaining to a communication protocol and associated with a communication between an initiating device and a receiving device; implementing a security protocol embedded within the communication protocol by: establishing, on a distributed ledger, a smart contract for tracking communication along a channel to a subsequent operator of a sequence of operators forming a communication path between the initiating and receiving device, the channel being at least a segment of the communication path, and registering the smart contract with a governing contract associated with an originating operator in communication with the initiating device over a local channel and configured to govern communication along the communication path; and transferring the notification to the subsequent operator along the at least segment of the communication path.
    Type: Application
    Filed: August 27, 2020
    Publication date: September 15, 2022
    Inventors: Arie Frenklakh, Leonid Rubanov, Boris Rakhlin
  • Disguising test pads in a semiconductor package
    Patent number: 8283664
    Abstract: A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: October 9, 2012
    Assignee: SanDisk Technologies Inc.
    Inventor: Arie Frenklakh
  • DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE
    Publication number: 20110156035
    Abstract: A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.
    Type: Application
    Filed: March 7, 2011
    Publication date: June 30, 2011
    Inventor: Arie Frenklakh
  • Disguising test pads in a semiconductor package
    Patent number: 7901957
    Abstract: A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: March 8, 2011
    Assignee: SanDisk Corporation
    Inventor: Arie Frenklakh
  • DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE
    Publication number: 20090152544
    Abstract: A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Inventor: Arie Frenklakh