Abstract: An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.

Abstract: A method for preparing a PCB product having highly dense conductors, the method including providing a PCB substrate including a conductive layer, employing an inkjet printer to selectively print unexposed photosensitive patterns on the PCB substrate, the unexposed photosensitive patterns having a thickness of less than 5 pm, exposing the photosensitive patterns to radiation thereby to define exposed patterns, the exposed patterns having a pitch less than 20 pm and wet etching the conductive layer in accordance with a pattern defined by the exposed patterns thereby to define the highly dense conductors having a pitch of less than 30 pm.

Abstract: An electron-beam induced plasma is utilized to establish a non-mechanical, electrical contact to a device of interest. This plasma source may be referred to as atmospheric plasma source and may be configured to provide a plasma column of very fine diameter and controllable characteristics. The plasma column traverses the atmospheric space between the plasma source into the atmosphere and the device of interest and acts as an electrical path to the device of interest in such a way that a characteristic electrical signal can be collected from the device. Additionally, by controlling the gases flowing into the plasma column the probe may be used for surface modification, etching and deposition.

Abstract: A non-mechanical contact signal measurement apparatus includes a first conductor on a structure under test and a gas in contact with the first conductor. At least one electron beam is directed into the gas so as to induce a plasma in the gas where the electron beam passes through the gas. A second conductor is in electrical contact with the plasma. A signal source is coupled to an electrical measurement device through the first conductor, the plasma, and the second conductor when the plasma is directed on the first conductor. The electrical measurement device is responsive to the signal source.

Abstract: An electron-beam induced plasmas is utilized to establish a non-mechanical, electrical contact to a device of interest. This plasma source may be referred to as atmospheric plasma source and may be configured to provide a plasma column of very fine diameter and controllable characteristics. The plasma column traverses the atmospheric space between the plasma source into the atmosphere and the device of interest and acts as an electrical path to the device of interest in such a way that a characteristic electrical signal can be collected from the device. Additionally, by controlling the gases flowing into the plasma column the probe may be used for surface modification, etching and deposition.

Abstract: A non-mechanical contact signal measurement apparatus includes a first conductor on a structure under test and a gas in contact with the first conductor. At least one electron beam is directed into the gas so as to induce a plasma in the gas where the electron beam passes through the gas. A second conductor is in electrical contact with the plasma. A signal source is coupled to an electrical measurement device through the first conductor, the plasma, and the second conductor when the plasma is directed on the first conductor. The electrical measurement device is responsive to the signal source.

Abstract: An apparatus is provided for testing microelectronic components on a substrate, including a scanner operative to scan a light beam over a plurality of thin film transistors disposed on a substrate, one transistor at a time, so as to induce a photoconductive response in the plurality of transistors, one transistor at a time; current sensing circuitry operative, synchronously with said scanner, to measure an output induced by the photoconductive response associated with a transistor and to generate photoconductive response output values, the photoconductive response output values representing a photoconductive response induced by the light beam, for one transistor at a time from among the plurality of transistors; and diagnostic apparatus operative to analyze the electronic response output values and to characterize each of the transistors in accordance therewith.

Abstract: Apparatus for testing microelectronic components on a substrate, including a scanner operative to scan a light beam over a plurality of thin film transistors disposed on a substrate, one transistor at a time, so as to induce a photoconductive response in the plurality of transistors, one transistor at a time; current sensing circuitry operative, synchronously with said scanner, to measure an output induced by the photoconductive response associated with a transistor and to generate photoconductive response output values, the photoconductive response output values representing a photoconductive response induced by the light beam, for one transistor at a time from among the plurality of transistors; and diagnostic apparatus operative to analyze the electronic response output values and to characterize each of the transistors in accordance therewith.

Abstract: A method of manufacturing includes depositing a material on a surface of a substrate in a liquid form using an inkjet process, whereby the material dries in an initial shape on the substrate. A photolithographic process is applied using a mask that is separate from the substrate in order to modify the initial shape.

Abstract: A method of manufacturing includes depositing a material on a surface of a substrate in a liquid form using an inkjet process, whereby the material dries in an initial shape on the substrate. A photolithographic process is applied using a mask that is separate from the substrate in order to modify the initial shape.

Abstract: A method of manufacturing includes depositing a material on a surface of a substrate in a liquid form using an inkjet process, whereby the material dries in an initial shape on the substrate. A photolithographic process is applied using a mask that is separate from the substrate in order to modify the initial shape.

Abstract: A system and method for selectable area laser treatment of a substrate, such as thin film transistors, the system including a holder holding a substrate in proximity to reactant, and laser beams each addressing independently selectable mutually set apart locations on the substrate to induce a reaction between the substrate and the reactant.

Abstract: A configuration builder useful in configuring software-containing hardware units which are serviced by a center which services a multiplicity of similar units having a plurality of different configurations, the configuration builder including: functionality enabling configuration of at least one software-containing hardware unit by a configurer; and functionality operative automatically in response to configuration of the at least one software-containing hardware unit for correspondingly configuring the center, thereby to enable the center to interface with the at least one software-containing hardware unit. Methodologies and point of sale systems employing the configuration building functionality are also disclosed.

Abstract: A method for fabricating a semiconductor device includes providing a layer of a semiconductor material on at least a portion of a surface of a substrate, and forming along the surface a capillary structure, which is in communication with the semiconductor material but is at least partially empty of the semiconductor material. The semiconductor material is heated, so as to cause the semiconductor material to melt and flow into the capillary structure. Upon allowing the semiconductor material to cool, a crystal is seeded in the capillary structure and spreads from the capillary structure through an area of the semiconductor material.

Abstract: A system and method for selectable area laser treatment of a substrate, such as thin film transistors, the system including a holder holding a substrate in proximity to reactant, and laser beams each addressing independently selectable mutually set apart locations on the substrate to induce a reaction between the substrate and the reactant.

Abstract: A mask and an assembly utilizable in the production of a multiplicity of capacitors on selected regions of a semiconductor wafer includes a shaped, thin sheet of material having spaced-apart holes made therein and at least one recess formed adjacent each of at least two opposite edges thereof, the recess being configured to be engaged by a substantially matching portion of a clamp releasably affixing the mask onto the wafer.