Patents by Inventor Arief Budiman Suriadi

Arief Budiman Suriadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical interconnect for an inkjet die
    Patent number: 6692111
    Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: February 17, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Timothy E. Beerling, Marvin G. Wong, Wan Sin Ng, Juliana Arifin, Jiansan Sun, Arief Budiman Suriadi, Naoto Kawamura
  • Electrical interconnect for an inkjet die
    Patent number: 6454955
    Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: September 24, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Timothy E. Beerling, Marvin G. Wong, Wan Sin Ng, Juliana Arifin, Jiansan Sun, Arief Budiman Suriadi, Naoto Kawamura
  • Electrical interconnect for an inkjet die
    Publication number: 20020122097
    Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.
    Type: Application
    Filed: February 22, 2002
    Publication date: September 5, 2002
    Inventors: Timothy E. Beerling, Marvin G. Wong, Wan Sin Ng, Juliana Arifin, Jiansan Sun, Arief Budiman Suriadi, Naoto Kawamura