Patents by Inventor Ariel Ben-Porath
Ariel Ben-Porath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7760347Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.Type: GrantFiled: May 15, 2006Date of Patent: July 20, 2010Assignee: Applied Materials, Inc.Inventors: Youval Nehmadi, Ofer Bokobza, Ariel Ben-Porath, Erez Ravid, Rinat Shishi, Vicky Svidenko, Gilad Almogy, Jacob J. Orbon, Jr.
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Patent number: 7760929Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.Type: GrantFiled: October 27, 2006Date of Patent: July 20, 2010Assignee: Applied Materials, Inc.Inventors: Jacob J. Orbon, Youval Nehmadi, Ofer Bokobza, Ariel Ben-Porath, Erez Ravid, Rinat Shimshi, Vicky Svidenko
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Process monitoring system and method for processing a large number of sub-micron measurement targets
Patent number: 7587700Abstract: The invention provides a method that includes the stages of: (i) receiving design information representative of a portion of an object that includes sub micron measurement targets, (ii) processing the received design information to provide a large number of measurement targets; and (iii) associating target measurement parameters to each of large number of measurement targets. The invention provides a system that includes: (i) an interface for receiving design information representative of a portion of a layer of an object that includes sub micron measurement targets; and (ii) a processor, coupled to the interface, for processing the received design information to provide a large number of measurement targets; and for associating target measurement parameters to each of large number of measurement targets.Type: GrantFiled: April 1, 2004Date of Patent: September 8, 2009Assignee: Applied Materials, Israel, Ltd.Inventors: Youval Nehmadi, Zamir Abraham, Gil Sod-Moriah, Yair Eran, Chen Ofek, Yaron Cohen, Ariel Ben-Porath -
Publication number: 20090007030Abstract: A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in a layer of the IC that is susceptible to a process fault. Upon fabricating the layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in the layer responsively to the PDP.Type: ApplicationFiled: October 3, 2006Publication date: January 1, 2009Inventors: Youval Nehmadi, Josephine Phua, Jacob Joseph Orbon, JR., Ariel Ben-Porath, Evgeny Levin, Ofer Bokobza
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Publication number: 20080161840Abstract: Apparatus is provided for removing plaque from a blood vessel of a subject, including a catheter shaped to define an opening that is placed in the blood vessel. A pressure source propels a fluid jet through the opening, and a pressure sensor detects a pressure in the blood vessel induced by the jet. A control unit steers the jet in response to the detected pressure. Other embodiments are also described.Type: ApplicationFiled: November 21, 2007Publication date: July 3, 2008Applicant: VASCURE LTD.Inventors: Ricardo Osiroff, Izhak Kirshenbaum, Yaniv Garty, Yosi Weitzman, Ariel Ben-Porath, Yossi Gross
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Publication number: 20080092088Abstract: The invention provides a method that includes the stages of: (i) receiving design information representative of a portion of an object that includes sub micron measurement targets, (ii) processing the received design information to provide a large number of measurement targets; and (iii) associating target measurement parameters to each of large number of measurement targets. The invention provides a system that includes: (i) an interface for receiving design information representative of a portion of a layer of an object that includes sub micron measurement targets; and (ii) a processor, coupled to the interface, for processing the received design information to provide a large number of measurement targets; and for associating target measurement parameters to each of large number of measurement targets.Type: ApplicationFiled: April 1, 2004Publication date: April 17, 2008Inventors: Youval Nehmadi, Zamir Abraham, Gil Sod-Moriah, Yair Eran, Chen Ofek, Yaron Cohen, Ariel Ben-Porath
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Patent number: 7217579Abstract: A method for electrically testing a semiconductor wafer during integrated-circuit fabrication process, the method including: (i) providing a scanning charged-particle microscope (SCPM), having a defined scanning plane and operative, while in any one mechanical state, to scan a surface in the scanning plane within a two-dimensional scanning window, which has a given maximum size; (ii) providing in association with any layer of the wafer, it being a test layer, one or more test structures, each test structure including normally conductive areas within a normally non-conductive background in one or more layers, which include said test layer, the conductive areas formed as one or more patterns; the patterns in said test layer include one or more clusters of mutually isolated pads; each pad is conductively connected with a corresponding distinct point on the patterns and all the pads in any one cluster are sized and arranged so that at least a significant portion of each pad falls within a common window whose sizeType: GrantFiled: December 19, 2002Date of Patent: May 15, 2007Assignee: Applied Materials, Israel, Ltd.Inventors: Ariel Ben-Porath, Douglas Ray Hendricks
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Publication number: 20070052963Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.Type: ApplicationFiled: October 27, 2006Publication date: March 8, 2007Inventors: JACOB ORBON, Youval Nehmadi, Ofer Bokobza, Ariel Ben-Porath, Erez Ravid, Rinat Shimshi, Vicky Svidenko
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Publication number: 20060269120Abstract: Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.Type: ApplicationFiled: May 15, 2006Publication date: November 30, 2006Inventors: YOUVAL NEHMADI, Ofer Bokobza, Ariel Ben-Porath, Erez Ravid, Rinat Shimsht, Vicky Svidenko, Gilad Almogy
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Patent number: 7135344Abstract: A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in at least one layer of the IC that is susceptible to a process fault. Upon fabricating at least one layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in at least one layer responsively to the PDP.Type: GrantFiled: February 17, 2004Date of Patent: November 14, 2006Assignee: Applied Materials, Israel, Ltd.Inventors: Youval Nehmadi, Josephine Phua, Jacob Joseph Orbon, Jr., Ariel Ben-Porath, Evgeny Levin, Ofer Bokobza
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Patent number: 6987873Abstract: A method and apparatus is provided for automatically classifying a defect on the surface of a semiconductor wafer into one of, e.g., seven core classes: a missing pattern on the surface, an extra pattern on the surface, a deformed pattern on the surface, a particle on the surface, a particle embedded in the surface, a particle and a deformed pattern on the surface, or craters and microscratches on the surface. The defect may also be further classified into a subclass of arbitrarily defined defects defined by the user or preprogrammed in the apparatus. Embodiments include using a scanning electron microscope (SEM) capable of collecting electrons emitted from a plurality of angular sectors to obtain an image of the defect and a reference image containing topographical and location information, then analyzing this information to classify the defect.Type: GrantFiled: July 8, 1998Date of Patent: January 17, 2006Assignee: Applied Materials, Inc.Inventors: Ariel Ben-Porath, Mark Wagner
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Patent number: 6922482Abstract: A method and apparatus is provided for automatically classifying a defect on the surface of a semiconductor wafer into one of a predetermined number of core classes using a core classifier employing boundary and topographical information. The defect is then further classified into a subclass of arbitrarily defined defects defined by the user with a specific adaptive classifier associated with the one core class and trained to classify defects only from a limited number of related core classes. Defects that cannot be classified by the core classifier or the specific adaptive classifiers are classified by a full classifier.Type: GrantFiled: June 15, 1999Date of Patent: July 26, 2005Assignee: Applied Materials, Inc.Inventor: Ariel Ben-Porath
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Publication number: 20050010890Abstract: A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the PDP comprising an indication of a site in at least one layer of the IC that is susceptible to a process fault. Upon fabricating at least one layer of the IC on the wafer, a process monitoring tool is applied to perform a measurement at the site in at least one layer responsively to the PDP.Type: ApplicationFiled: February 17, 2004Publication date: January 13, 2005Inventors: Youval Nehmadi, Josephine Phua, Jacob Orbon, Ariel Ben-Porath, Evgeny Levin, Ofer Bokobza
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Publication number: 20040121497Abstract: A method for electrically testing a semiconductor wafer during integrated-circuit fabrication process, the method including: (i) providing a scanning charged-particle microscope (SCPM), having a defined scanning plane and operative, while in any one mechanical state, to scan a surface in the scanning plane within a two-dimensional scanning window, which has a given maximum size; (ii) providing in association with any layer of the wafer, it being a test layer, one or more test structures, each test structure including normally conductive areas within a normally non-conductive background in one or more layers, which include said test layer, the conductive areas formed as one or more patterns; the patterns in said test layer include one or more clusters of mutually isolated pads; each pad is conductively connected with a corresponding distinct point on the patterns and all the pads in any one cluster are sized and arranged so that at least a significant portion of each pad falls within a common window whose sizeType: ApplicationFiled: December 19, 2002Publication date: June 24, 2004Applicant: Applied Materials Israel Ltd.Inventors: Ariel Ben-Porath, Douglas Ray Hendricks
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Patent number: 6673657Abstract: A kill index classification method for prioritizing relational aspects of topological defect intersections, particularly in association with an intermediate analytical testing stage of a multi-stage semiconductor fabrication process. The method relates to an analysis of the geometrical relationship between non-predetermined portion(s), generally referred to as defects, and the surrounding predetermined topology of a conductive semiconductor pattern, to determine the effect of defects on the functionality and reliability of a wafer, and particularly an examined die thereon. Further, in accordance with this geometrical information, a preferred classification of the effects of defects into a numerical value, the “kill index”, is achieved. Preferably, this kill index is strongly linked, correlated and related to the damage caused by the defect to the functionality and/or reliability of the underlying integrated circuit.Type: GrantFiled: July 11, 2002Date of Patent: January 6, 2004Assignee: Applied Materials, Inc.Inventors: Ayelet Pnueli, Ariel Ben-Porath
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Patent number: 6670610Abstract: A system and method for directing the object, such as a semiconductor die. The system includes a first images such as a scanning electron microscope, a stage for moving the object and a second imager and miller such as a focused ion beam generator. The object is images to locate a desired location in which the object is to be milled and a landmark that is utilized for directing the miller. The system can include additional steps of milling, analyzing and movement of the object.Type: GrantFiled: November 26, 2001Date of Patent: December 30, 2003Assignee: Applied Materials, Inc.Inventors: Dror Shemesh, Ariel Ben-Porath, Dubi Shachal, Alexey Stepanov
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Publication number: 20030207519Abstract: A kill index classification method for prioritizing relational aspects of topological defect intersections, particularly in association with an intermediate analytical testing stage of a multi-stage semiconductor fabrication process. The method relates to an analysis of the geometrical relationship between non-predetermined portion(s), generally referred to as defects, and the surrounding predetermined topology of a conductive semiconductor pattern, to determine the effect of defects on the functionality and reliability of a wafer, and particularly an examined die thereon. Further, in accordance with this geometrical information, a preferred classification of the effects of defects into a numerical value, the “kill index”, is achieved. Preferably, this kill index is strongly linked, correlated and related to the damage caused by the defect to the functionality and/or reliability of the underlying integrated circuit.Type: ApplicationFiled: May 13, 2003Publication date: November 6, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Ayelet Pnueli, Ariel Ben-Porath
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Patent number: 6605478Abstract: A kill index classification method for prioritizing relational aspects of topological defect intersections, particularly in association with an intermediate analytical testing stage of a multi-stage semiconductor fabrication process. The method relates to an analysis of the geometrical relationship between non-predetermined portion(s), generally referred to as defects, and the surrounding predetermined topology of a conductive semiconductor pattern, to determine the effect of defects on the functionality and reliability of a wafer, and particularly an examined die thereon. Further, in accordance with this geometrical information, a preferred classification of the effects of defects into a numerical value, the “kill index”, is achieved. Preferably, this kill index is strongly linked, correlated and related to the damage caused by the defect to the functionality and/or reliability of the underlying integrated circuit.Type: GrantFiled: March 30, 2001Date of Patent: August 12, 2003Assignee: Appleid Materials, Inc,Inventors: Ayelet Pnueli, Ariel Ben-Porath
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Publication number: 20030098416Abstract: A system and method for directing the object, such as a semiconductor die. The system includes a first images such as a scanning electron microscope, a stage for moving the object and a second imager and miller such as a focused ion beam generator. The object is images to locate a desired location in which the object is to be milled and a landmark that is utilized for directing the miller. The system can include additional steps of milling, analyzing and movement of the object.Type: ApplicationFiled: November 26, 2001Publication date: May 29, 2003Inventors: Dror Shemesh, Ariel Ben-Porath, Dubi Shachal, Alexey Stepanov
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Publication number: 20030017664Abstract: A kill index classification method for prioritizing relational aspects of topological defect intersections, particularly in association with an intermediate analytical testing stage of a multi-stage semiconductor fabrication process. The method relates to an analysis of the geometrical relationship between non-predetermined portion(s), generally referred to as defects, and the surrounding predetermined topology of a conductive semiconductor pattern, to determine the effect of defects on the functionality and reliability of a wafer, and particularly an examined die thereon. Further, in accordance with this geometrical information, a preferred classification of the effects of defects into a numerical value, the “kill index”, is achieved. Preferably, this kill index is strongly linked, correlated and related to the damage caused by the defect to the functionality and/or reliability of the underlying integrated circuit.Type: ApplicationFiled: July 11, 2002Publication date: January 23, 2003Applicant: APPLIED MATERIALS, INCInventors: Ayelet Pnueli, Ariel Ben-Porath