Patents by Inventor Ariel L. Miranda

Ariel L. Miranda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING A PROBE PAD LAYOUT/DESIGN, AND RELATED DEVICE
    Publication number: 20090189299
    Abstract: A method of forming a probe pad layout/design, and related device. At least some of the illustrative embodiments are methods comprising testing a semiconductor device by electrically contacting a first portion of a semiconductor die by way of a first pad within a scribe street adjacent to the semiconductor die, and electrically contacting a second portion of the semiconductor die by way of a first bond pad within the semiconductor die.
    Type: Application
    Filed: January 30, 2008
    Publication date: July 30, 2009
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ariel L. Miranda, Norihiro Kawakami, Charles A. Odegard
  • MULTILAYER DICING BLADE
    Publication number: 20080092714
    Abstract: A semiconductor dicing blade comprising a blade body, a first grit located within a core of the blade body, and a second different grit located on a side surface of the blade body wherein the first grit has a first grit size and is exposed at a lead cutting edge of the blade body, and wherein a largest grit particle of the second different grit is smaller than a smallest grit particle of the first grit. A method of cutting a semiconductor wafer is also provided.
    Type: Application
    Filed: October 9, 2006
    Publication date: April 24, 2008
    Applicant: Texas Instruments Incorporated
    Inventors: Ariel L. Miranda, Jeniffer V. Otero, Richard M. Ainza