Abstract: A one or two-dimensional capacitive micro-machined ultrasonic transducer (CMUT) array with supporting frame is provided. The CMUT array has at least three array elements deposited on a conductive substrate. The invention also has at least one CMUT cell in the array element, a conductive top layer deposited to a top side of the element, and a conductive via disposed within the elements. The via is isolated from the conductive top layer and conducts with the substrate. There are at least two isolation trenches in the conductive substrate, and the trenches are disposed between adjacent vias to conductively isolating the vias. A substrate region between the trenches forms a mechanical support frame. At least one conductive electrode is deposited to a bottom surface of the conductive substrate, where the electrode conducts with the via. The support frame eliminates the need for a carrier wafer in the process steps.

Abstract: Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be substantially independently adjusted. CMUT having trenched membrane and/or membrane with non-uniform thickness or density. Method for operating transducer or vibrating membrane device. Array of devices at least some of which have non-uniform membrane properties. CMUT comprising substrate, support for membrane, and membrane extending over support to create cavity, membrane having non-uniform membrane thickness resulting from at least one of: thickening on upper surface of the membrane outside of cavity, thickening on lower surface of membrane inside cavity, trench on upper surface of membrane, trench on lower surface of the membrane, and any combination of two or more of these. Method for fabricating CMUT or vibrating membrane device having non-uniform membrane.

Abstract: The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.

Abstract: A capacitive membrane ultrasonic transducer which includes a membrane supported by a substrate in which ultrasonic bulk waves at the frequency of operation of the transducers are suppressed by configuring the substrate and a method of suppressing the ultrasonic bulk waves.