Abstract: A method of electrically modeling a semiconductor package is provided. The method reduces computation time for mutual inductance calculations between interconnect lines of the semiconductor package. Only interconnect within a predetermined distance of an interconnect line being modeled is calculated for mutual inductance. The predetermined distance is selected such that any interconnect line greater than the predetermined distance away from the interconnect line being modeled produces a negligible or small mutual inductance. This greatly reduces the number of calculations for semiconductor packages having a large number of interconnect lines. Each interconnect line modeled is broken into segments for calculating mutual inductance. An algorithm is used that calculates the mutual inductance between a pair of arbitrarily oriented straight line metal segments.

Abstract: A method for automated artwork building which comprises determining a desired die pad pitch, assigning inner lead bonding positions for each lead based on the average die pitch. The desired outer lead bonding position is then determined for each lead. The allowable range of fan in and fan out angles for each lead is computed according to design and manufacturing constraints. An electrical cost function is formulated based on signal lead crosstalk and ground lead simultaneous switching noise. Each lead is then routed. The routing is repeated for each lead for each allowable combination of fan in and fan out angles. Finally the optimal routing is selected based on electrical characteristics.