Patents by Inventor Arin Abed

Arin Abed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTOELECTRONIC MODULE PACKAGE
    Publication number: 20220262962
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 18, 2022
    Inventors: Gerald Cois BYRD, Thomas Pierre SCHRANS, Chia-Te CHOU, Arin ABED, Omar James BCHIR, Erman TIMURDOGAN, Aaron John ZILKIE
  • OPTOELECTRONIC MODULE PACKAGE
    Publication number: 20220109075
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 7, 2022
    Inventors: Gerald Cois BYRD, Thomas Pierre SCHRANS, Chia-Te CHOU, Arin ABED, Omar James BCHIR
  • Optoelectronic module package
    Patent number: 11239377
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 1, 2022
    Assignee: Rockley Photonics Limited
    Inventors: Gerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
  • OPTOELECTRONIC MODULE PACKAGE
    Publication number: 20190044002
    Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.
    Type: Application
    Filed: August 6, 2018
    Publication date: February 7, 2019
    Inventors: Gerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
  • Edge construction on optical devices
    Patent number: 10120133
    Abstract: A method of forming an optical device includes obtaining a wafer having multiple optical device dies that each includes a waveguide. The method also includes forming a facet on the waveguide of different dies. The method further includes separating the dies from the wafer after forming the facets. The dies are separated from the wafer such that the facets are positioned at an edge of the dies.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 6, 2018
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventors: Scott Benjamin Golper, William Dos Santos Fegadolli, Arin Abed
  • EDGE CONSTRUCTION ON OPTICAL DEVICES
    Publication number: 20170176682
    Abstract: A method of forming an optical device includes obtaining a wafer having multiple optical device dies that each includes a waveguide. The method also includes forming a facet on the waveguide of different dies. The method further includes separating the dies from the wafer after forming the facets. The dies are separated from the wafer such that the facets are positioned at an edge of the dies.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Scott Benjamin Golper, William Dos Santos Fegadolli, Arin Abed