Patents by Inventor Arindum Dutta
Arindum Dutta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6694609Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.Type: GrantFiled: March 22, 2001Date of Patent: February 24, 2004Assignee: Molex IncorporatedInventors: John E. Lopata, James L. McGrath, Arindum Dutta, Marvin Menzin, Daniel Fisher, Jr.
-
Patent number: 6679733Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.Type: GrantFiled: December 13, 2001Date of Patent: January 20, 2004Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Publication number: 20030202330Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents.Type: ApplicationFiled: September 25, 2002Publication date: October 30, 2003Inventors: John D. Lopata, Augusto P. Panella, Arindum Dutta, James L. McGrath
-
Publication number: 20030198033Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.Type: ApplicationFiled: February 25, 2003Publication date: October 23, 2003Inventors: Augusto P. Panella, John E. Lopata, James L. McGrath, Arindum Dutta
-
Publication number: 20030197198Abstract: A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The power reservoir is integrated into a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least one opening that opens up to a operational surface of the integrated circuit. A heat-dissapating device, such as a finned heat sink or the like is supported by the cover member and extends through its opening into contact with a heat-generating surface of the integrated circuit to cool it during operation.Type: ApplicationFiled: September 26, 2002Publication date: October 23, 2003Inventors: Augusto P. Panella, Arindum Dutta, James L. McGrath
-
Publication number: 20030194832Abstract: Systems for power delivery to an integrated circuit include a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system delivers power to the IC along various surfaces thereof by way of a plurality of discrete capacitors that are supported by a socket-style connector. The socket-style connector has an insulative body portion that is mounted to a circuit board and has a recess defined thereon that receives the IC therein. A plurality of capacitors are integrated with the body portion and, each of the capacitors supplies a desired amount of power to the IC. The capacitors are charged by way of leads on the circuit board that bring power to current to the capacitors and then are discharged as the IC draws power from the socket such that the capacitors form a power reservoir integrated with the socket, thereby eliminating the need for mounting such capacitors on the circuit board near the IC and freeing up space on the circuit board.Type: ApplicationFiled: September 25, 2002Publication date: October 16, 2003Inventors: John E.. Lopata, Augusto P. Panella, Arindum Dutta, Jeoffrey Urbanowski
-
Publication number: 20030181104Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.Type: ApplicationFiled: December 30, 2002Publication date: September 25, 2003Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
-
Publication number: 20030179050Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.Type: ApplicationFiled: December 27, 2002Publication date: September 25, 2003Inventors: David L. Brunker, Daniel L. Dawiedczyk, John E. Lopata, Arindum Dutta
-
Patent number: 6461197Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.Type: GrantFiled: May 21, 2001Date of Patent: October 8, 2002Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Publication number: 20020137365Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.Type: ApplicationFiled: March 22, 2001Publication date: September 26, 2002Inventors: James L. McGrath, John E. Lopata, Arindum Dutta, Marvin Menzin, Daniel Fisher
-
Publication number: 20020133944Abstract: A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.Type: ApplicationFiled: March 22, 2001Publication date: September 26, 2002Inventors: John E. Lopata, James L. McGrath, Arindum Dutta, Marvin Menzin, Daniel Fisher
-
Publication number: 20020042225Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.Type: ApplicationFiled: December 13, 2001Publication date: April 11, 2002Applicant: THE PANDA PROJECTInventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Publication number: 20020019174Abstract: An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding.Type: ApplicationFiled: October 16, 2001Publication date: February 14, 2002Applicant: SILICON BANDWIDTH, INC.Inventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Arindum Dutta
-
Patent number: 6334794Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.Type: GrantFiled: March 3, 1999Date of Patent: January 1, 2002Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Publication number: 20010034164Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.Type: ApplicationFiled: May 21, 2001Publication date: October 25, 2001Applicant: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Patent number: 6305987Abstract: An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding.Type: GrantFiled: February 12, 1999Date of Patent: October 23, 2001Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta
-
Patent number: 6247972Abstract: An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins.Type: GrantFiled: August 14, 1997Date of Patent: June 19, 2001Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Patent number: 6050850Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.Type: GrantFiled: August 14, 1997Date of Patent: April 18, 2000Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link
-
Patent number: 6031720Abstract: A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.Type: GrantFiled: November 14, 1997Date of Patent: February 29, 2000Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Arindum Dutta, Kevin J. Link, Bill Ahearn
-
Patent number: 5951665Abstract: A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output board coupled to the pluggable logic board through the bus system; a first connector unit for directly connecting the pluggable central processing unit circuit board to a first predetermined location on the pluggable logic board; and a second connector unit for directly connecting the pluggable logic board to a predetermined location on the pluggable input/output board.Type: GrantFiled: November 14, 1997Date of Patent: September 14, 1999Assignee: The Panda ProjectInventors: Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Daniel Fuoco, Roy K. Lee, Kevin J. Link, Moises Behar, Arindum Dutta, William Cross