Patents by Inventor Aristide Gumyusenge

Aristide Gumyusenge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250146966
    Abstract: Compositions comprising an electronically conductive polymer and a metal-organic framework (MOF), and related sensors and methods of sensing analytes, are generally described.
    Type: Application
    Filed: October 21, 2024
    Publication date: May 8, 2025
    Applicant: Massachusetts Institute of Technology
    Inventors: Aristide Gumyusenge, Heejung Roh
  • Patent number: 12096641
    Abstract: A transistor device that includes a substrate comprising metallic gate contacts, a dielectric layer on the substrate comprising a polyimide or derivative thereof, a semiconductor layer on the dielectric layer comprising a semiconducting polymer confined in a host matrix material comprising a polyimide or derivative thereof, and source and drain contacts on the semiconductor layer.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: September 17, 2024
    Assignee: Purdue Research Foundation
    Inventors: Jianguo Mei, Aristide Gumyusenge
  • Patent number: 11594682
    Abstract: A composition for use as an electronic material. The composition contains at least one organic semiconducting material, and at least one electrically insulating polymer forming a semiconducting blend wherein the insulating polymer acts as a matrix for the organic semiconducting material resulting in an interpenetrating morphology of the polymer and the semiconductor material. The variation of charge carrier mobility with temperature in the semiconducting blend is less than 20 percent in a temperature range. A method of making a film of an electronic material. The method includes dissolving at least one organic semiconducting material and at least one insulating polymer into an organic solvent in a pre-determined ratio resulting in a semiconducting blend, depositing the blend onto a substrate to form a film comprising an interpenetrating morphology of the at least one insulating polymer and the at least one organic semiconductor material.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: February 28, 2023
    Assignee: Purdue Research Foundation
    Inventors: Jianguo Mei, Aristide Gumyusenge
  • Publication number: 20220223808
    Abstract: A transistor device that includes a substrate comprising metallic gate contacts, a dielectric layer on the substrate comprising a polyimide or derivative thereof, a semiconductor layer on the dielectric layer comprising a semiconducting polymer confined in a host matrix material comprising a polyimide or derivative thereof, and source and drain contacts on the semiconductor layer.
    Type: Application
    Filed: June 3, 2021
    Publication date: July 14, 2022
    Inventors: Jianguo Mei, Aristide Gumyusenge
  • Publication number: 20220149285
    Abstract: A composition for use as an electronic material. The composition contains at least one organic semiconducting material, and at least one electrically insulating polymer forming a semiconducting blend wherein the insulating polymer acts as a matrix for the organic semiconducting material resulting in an interpenetrating morphology of the polymer and the semiconductor material. The variation of charge carrier mobility with temperature in the semiconducting blend is less than 20 percent in a temperature range. A method of making a film of an electronic material. The method includes dissolving at least one organic semiconducting material and at least one insulating polymer into an organic solvent in a pre-determined ratio resulting in a semiconducting blend, depositing the blend onto a substrate to form a film comprising an interpenetrating morphology of the at least one insulating polymer and the at least one organic semiconductor material.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 12, 2022
    Applicant: Purdue Research Foundation
    Inventors: Jianguo Mei, Aristide Gumyusenge
  • Patent number: 11183638
    Abstract: A composition for use as an electronic material. The composition contains at least one organic semiconducting material, and at least one electrically insulating polymer forming a semiconducting blend wherein the insulating polymer acts as a matrix for the organic semiconducting material resulting in an interpenetrating morphology of the polymer and the semiconductor material. The variation of charge carrier mobility with temperature in the semiconducting blend is less than 20 percent in a temperature range. A method of making a film of an electronic material. The method includes dissolving at least one organic semiconducting material and at least one insulating polymer into an organic solvent in a pre-determined ratio resulting in a semiconducting blend, depositing the blend onto a substrate to form a film comprising an interpenetrating morphology of the at least one insulating polymer and the at least one organic semiconductor material.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: November 23, 2021
    Assignee: Purdue Research Foundation
    Inventors: Jianguo Mei, Aristide Gumyusenge
  • Publication number: 20190372006
    Abstract: A composition for use as an electronic material. The composition contains at least one organic semiconducting material, and at least one electrically insulating polymer forming a semiconducting blend wherein the insulating polymer acts as a matrix for the organic semiconducting material resulting in an interpenetrating morphology of the polymer and the semiconductor material. The variation of charge carrier mobility with temperature in the semiconducting blend is less than 20 percent in a temperature range. A method of making a film of an electronic material. The method includes dissolving at least one organic semiconducting material and at least one insulating polymer into an organic solvent in a pre-determined ratio resulting in a semiconducting blend, depositing the blend onto a substrate to form a film comprising an interpenetrating morphology of the at least one insulating polymer and the at least one organic semiconductor material.
    Type: Application
    Filed: May 24, 2019
    Publication date: December 5, 2019
    Applicant: Purdue Research Foundation
    Inventors: Jianguo Mei, Aristide Gumyusenge