Abstract: A plurality of memory cell stacks are formed over a substrate. The substrate does not have diffusion regions between each memory cell stack to link the memory cells. The cells are formed close enough such that the memory cells are linked serially by the electric fields generated by each floating gate in the channel regions. In one embodiment, an n-layer is implanted at the top of the substrate to increase conductivity between cells. The select transistors can be linked to the serial string by diffusion regions or by interaction of the electric fields between the select transistor channel and the memory cell channel.