Abstract: A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are arranged at opposing surfaces of the molds and symmetrically formed with respect to a parting face of the mold tool to connect with the cavities. A method for forming the component includes the steps of inserting the supporting member with the chip in the cavities of the molds of the mold tool, clamping the molds, injecting molten resin into the cavities of the clamped molds through the upper and lower gates, cooling the molten resin in the cavities, and separating the molds from each other and removing the component from the cavities.