Abstract: An electronics backplane assembly includes respective first and second floating backplane connector assemblies each having a backplane connector coupled to a corresponding backplane plate movably coupled with a chassis wall, and a pair of stepped stoppers coupled to the chassis wall and positioned on each side of each backplane plate. Each stepped stopper pair includes a step at a different distance from the chassis wall and positioned to provide a reactive force to the corresponding backplane plate for incrementally engaging respective backplane connectors of an electronics module with a corresponding floating backplane connector. Each floating backplane connector assembly may include a pair of guide stoppers having a stopper structure at respective positions, coupled to the chassis wall and protruding through holes in each backplane plate, where each backplane plate is positioned for connector engagement between the step structure of each stepped stopper and the stopper structure of each guide stopper.

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

Abstract: Systems and methods are described for assembling multiple circuit boards using support elements to provide a stacked circuit board assembly. A support element is mounted to a first (e.g., main) circuit board, and a pair of additional circuit boards (e.g., daughter boards) are mounted to the support element on two opposite sides of the first circuit board to provide a stacked circuit board assembly.

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

Abstract: Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

Abstract: In one embodiment, an apparatus includes a frame for mounting in a rack in a position adjacent and external to a network device supported by the rack and a filter module for holding a filter for filtering air entering an air inlet of the network device. The frame includes an opening for receiving the filter module and positions the filter adjacent to the air inlet of the network device when installed on the rack.

Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.

Abstract: In one embodiment, an apparatus includes a frame for mounting in a rack in a position adjacent and external to a network device supported by the rack and a filter module for holding a filter for filtering air entering an air inlet of the network device. The frame comprises an opening for receiving the filter module and positions the filter adjacent to the air inlet of the network device when installed on the rack.

Abstract: In one embodiment, an adjustable cable management system is disclosed. The system includes a tray base having a first end. The system also includes a tray door coupled to the tray base and substantially opposite the first end of the tray base when in a closed position. The system further includes a plurality of cable guides coupled to the first end of the tray base and located between the first end of the tray base and the tray door. A particular cable guide is coupled to the first end of the tray base at a selected angle from among a plurality of selectable angles.

Abstract: In one embodiment, an adjustable cable management system is disclosed. The system includes a tray base having a first end. The system also includes a tray door coupled to the tray base and substantially opposite the first end of the tray base when in a closed position. The system further includes a plurality of cable guides coupled to the first end of the tray base and located between the first end of the tray base and the tray door. A particular cable guide is coupled to the first end of the tray base at a selected angle from among a plurality of selectable angles.

Abstract: A UPS with an adjustable user interface module comprises a housing having a front plane and a module configured to fit inside and secured by the housing. The module includes a body having a front face, and the module is configured to tilt within the housing such that the front face of the module can be positioned at various angles relative to the front plane of the housing.

Abstract: A UPS with an adjustable user interface module comprises a housing having a front plane and a module configured to fit inside and secured by the housing. The module includes a body having a front face, and the module is configured to tilt within the housing such that the front face of the module can be positioned at various angles relative to the front plane of the housing.

Abstract: A mechanism for adjusting the orientation of a user interface of an electronic system component from a rack mounted orientation to a tower orientation.

Abstract: A mechanism for adjusting the orientation of a user interface of an electronic system component from a rack mounted orientation to a tower orientation.