Patents by Inventor Arjun Partha

Arjun Partha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package with diamond heat sink
    Patent number: 6466446
    Abstract: An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: October 15, 2002
    Assignee: Saint Gobain/Norton Industrial Ceramics Corporation
    Inventors: Bela Nagy, Arjun Partha