Patents by Inventor Arjun SelVakumar
Arjun SelVakumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12025762Abstract: A nodal seismic unit for acquiring seismic information includes an enclosure, a GPS receiver disposed in the enclosure; a motion sensor disposed in the enclosure; a LPWAN radio transceiver disposed in the enclosure; and a control unit disposed in the enclosure. The control unit is configured to transmit an unplanned movement signal to a remote operator using the LPWAN radio transceiver if the control unit receives a signal from the motion sensor indicative of an acceleration greater than a preset level. Additionally, the control unit may be configured to change an operating state of the nodal seismic unit in response to detecting a predetermined pattern of motion using the motion sensor.Type: GrantFiled: April 21, 2021Date of Patent: July 2, 2024Assignee: Inova Ltd.Inventor: Arjun Selvakumar
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Publication number: 20230350087Abstract: A seismic survey uses a central control and a seismic source. The seismic source has a vibrator that acoustically couples to the ground using a moveable pad. A method for performing a seismic survey includes sending a first message from the seismic source to the central control indicating a time at which the pad is being lowered; estimating a time at which the pad will be acoustically coupled to the ground based on the first message; and sending a message from the central control to the seismic source to begin a sweep, the sweep beginning no sooner than the estimated time. Another method includes: mapping a surface of a terrain to be traversed by the truck using at least one sensor carried by the truck; positioning a moveable pad based on the mapped surface to provide a physical gap between the surface and the moveable pad; and traversing the mapped terrain with the truck.Type: ApplicationFiled: November 23, 2020Publication date: November 2, 2023Applicant: INOVA LTD.Inventors: Hua Ai, Arjun Selvakumar
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Publication number: 20230168403Abstract: A nodal seismic unit for acquiring seismic information includes an enclosure, a GPS receiver disposed in the enclosure; a motion sensor disposed in the enclosure; a LPWAN radio transceiver disposed in the enclosure; and a control unit disposed in the enclosure. The control unit is configured to transmit an unplanned movement signal to a remote operator using the LPWAN radio transceiver if the control unit receives a signal from the motion sensor indicative of an acceleration greater than a preset level. Additionally, he control unit may be configured to change an operating state of the nodal seismic unit in response to detecting a predetermined pattern of motion using the motion sensor.Type: ApplicationFiled: April 21, 2021Publication date: June 1, 2023Applicant: INOVA LTD.Inventor: Arjun Selvakumar
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Patent number: 10145971Abstract: Methods, apparatuses, and systems are disclosed for multi-station sensor strings. One example apparatus includes a sensor string. The sensor string includes a connector and a common data transmission channel configured to be in communication with a data acquisition unit through the connector. The sensor string also includes a first seismic sensor configured to provide sensed seismic data to the common data transmission channel, and a second seismic sensor also configured to provide sensed seismic data to the common data transmission channel.Type: GrantFiled: September 15, 2014Date of Patent: December 4, 2018Assignee: INOVA LTDInventors: Wilfred Bertrand, Arjun Selvakumar
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Publication number: 20150078127Abstract: Methods, apparatuses, and systems are disclosed for multi-station sensor strings. One example apparatus includes a sensor string. The sensor string includes a connector and a common data transmission channel configured to be in communication with a data acquisition unit through the connector. The sensor string also includes a first seismic sensor configured to provide sensed seismic data to the common data transmission channel, and a second seismic sensor also configured to provide sensed seismic data to the common data transmission channel.Type: ApplicationFiled: September 15, 2014Publication date: March 19, 2015Inventors: Wilfred Bertrand, Arjun Selvakumar
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Patent number: 7274079Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: GrantFiled: August 22, 2005Date of Patent: September 25, 2007Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard D. Goldberg, Duli Yu, Matthew Ip, Martin A. Schmidt, James L. Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 7236279Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.Type: GrantFiled: October 18, 2002Date of Patent: June 26, 2007Assignee: Input/Output, Inc.Inventors: Duli Yu, Arjun Selvakumar, Howard Goldberg, Taechung Yi
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Patent number: 7152473Abstract: A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).Type: GrantFiled: March 17, 2000Date of Patent: December 26, 2006Assignee: Input/Output, Inc.Inventors: Larry Rushefsky, Axel Sigmar, Howard D. Goldberg, W. Marc Stalnaker, Ray Rinne, Demetrios Balderes, Guido Lemke, Matthew Ip, Lawrence P. Behn, Klaus Domagalski, Lianzhong Yu, Arjun Selvakumar, Duli Yu, James L. Marsh, Peter Maxwell, David Morgan, Thomas Buie, Kees Faber, Sjoerd Altman, Richard Laroo
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Publication number: 20050277219Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: ApplicationFiled: August 22, 2005Publication date: December 15, 2005Applicant: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard Goldberg, Duli Yu, Matthew Ip, Martin Schmidt, James Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 6945110Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: GrantFiled: July 21, 2004Date of Patent: September 20, 2005Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard D. Goldberg, Duli Yu, Matthew Ip, Martin A. Schmidt, James L. Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 6871544Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: GrantFiled: March 16, 2000Date of Patent: March 29, 2005Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Howard D. Goldberg, Duli Yu, Matthew Ip, Martin A. Schmidt, James L. Marsh, Bing-Fai Fung, Philip Simon
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Patent number: 6861587Abstract: A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.Type: GrantFiled: March 15, 2000Date of Patent: March 1, 2005Assignee: Input/Output, Inc.Inventors: Arjun SelVakumar, James L. Marsh, Howard D. Goldberg, Duli Yu, W. Marc Stalnaker
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Publication number: 20050000082Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).Type: ApplicationFiled: July 21, 2004Publication date: January 6, 2005Inventors: Arjun Selvakumar, Howard Goldberg, Duli Yu, Matthew Ip, Martin Schmidt, James Marsh, Bing-Fai Fung, Philip Simon
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Publication number: 20040255675Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.Type: ApplicationFiled: July 22, 2004Publication date: December 23, 2004Applicant: Input/Output, Inc.Inventors: Arjun Selvakumar, Duli Yu, Lianzhong Yu, Ben W. Jones
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Patent number: 6805008Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.Type: GrantFiled: June 21, 2001Date of Patent: October 19, 2004Assignee: Input/Output, Inc.Inventors: Arjun Selvakumar, Duli Yu, Lianzhong Yu, Ben W. Jones
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Publication number: 20030118277Abstract: The present invention provides a digital optical switch apparatus and process for manufacturing the apparatus. The apparatus includes a mirror assembly coupled to a top cap and to a bottom cap. The top and bottom caps each include one or more electrodes that, when energized with electrical energy, move a mirrored surface to one of a plurality of discrete positions. Mirror assemblies can be cascaded to create a packaged assembly having any multiple of discrete positions. The process includes planar micro-machining techniques to create isolated islands for electrical feed through. The process enables mechanical bonding of multiple tiers via a single bond region and through a bond-pad window.Type: ApplicationFiled: October 18, 2002Publication date: June 26, 2003Applicant: Input/Output, Inc.Inventors: Duli Yu, Arjun Selvakumar, Howard Goldberg, Taechung Yi
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Publication number: 20020178817Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.Type: ApplicationFiled: June 21, 2001Publication date: December 5, 2002Applicant: Input/Output, Inc.Inventors: Arjun Selvakumar, Duli Yu, Lianzhong Yu, Ben W. Jones
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Publication number: 20020104379Abstract: An accelerometer for measuring seismic data. The accelerometer includes a measurement mass assembly having top and bottom electrodes, a top capacitor electrode, and bottom capacitor electrode. One or more of the electrodes include re-entrant openings formed in the surface of the electrodes.Type: ApplicationFiled: May 29, 2001Publication date: August 8, 2002Applicant: Input/Output, Inc.Inventors: Robert Ried, Arjun Selvakumar, Howard Goldberg, Martin Schmidt, Lianzhong Yu