Abstract: In one embodiment, a circuit for providing a tail current for a line driver includes an adjustable current source. The adjustable current source includes a number of current source cells coupled together in a parallel configuration, where the current source cells are configured to provide the tail current for the line driver in response to a digital control signal. The circuit can further include a digital core coupled to the adjustable current source, where the digital core provides the digital control signal. The digital control signal provides a number of bits, where each bit controls one of the current source cells. In one embodiment, a current source cell can comprise a number of current source sub-cells. The current source cells can be configured to provide the tail current for the line driver in response to the digital control signal when the line driver is operating in a class AB mode.

Abstract: According to one exemplary embodiment, an active termination circuit includes at least one active termination branch, where the at least one active termination branch includes at least one transistor for providing an active termination output. The at least one active termination branch further includes an amplifier driving the at least one transistor, where the amplifier has a non-inverting input coupled to the active termination output via a feedback network. The amplifier controls a current flowing through the at least one transistor so as to provide the active termination output. The active termination output can be provided at a drain of the at least one transistor, where a source of the at least one transistor is coupled to ground through a degeneration transistor and a tail current sink.

Abstract: A system and method are provided allowing for successive approximation analog to digital conversion. A first differential voltage is sampled and held during a first cycle. The first differential voltage is converted to a differential current. A second differential voltage is generated based on the differential current flowing through parallel-coupled respective first and second variable resistances. First and second portions of the second differential voltage are compared to produce a comparison result therefrom. Successive approximation is used to generate a signal based on the comparison result, the signal being an output signal and being used to control resistances of respective ones of the first and second variable resistances during subsequent cycles.

Abstract: A system and method are provided allowing for successive approximation analog to digital conversion. A first differential voltage is sampled and held during a first cycle. The first differential voltage is converted to a differential current. A second differential voltage is generated based on the differential current flowing through parallel-coupled respective first and second variable resistances. First and second portions of the second differential voltage are compared to produce a comparison result therefrom. Successive approximation is used to generate a signal based on the comparison result, the signal being an output signal and being used to control resistances of respective ones of the first and second variable resistances during subsequent cycles.

Abstract: A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.

Abstract: A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.

Abstract: A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.

Abstract: A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.