Abstract: Structures for a bipolar junction transistor and methods of forming a structure for a bipolar junction transistor. The structure includes a first terminal having a first raised semiconductor layer on a semiconductor substrate, a second terminal having a second raised semiconductor layer on the semiconductor substrate, and an intrinsic base on the semiconductor substrate. The intrinsic base is positioned in a lateral direction between the first raised semiconductor layer of the first terminal and the second raised semiconductor layer of the second terminal. The intrinsic base includes a portion containing silicon-germanium with a germanium concentration that is graded in the lateral direction.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to annular bipolar transistors and methods of manufacture. The structure includes: a substate material; a collector region parallel to and above the substrate material; an intrinsic base region surrounding the collector region; an emitter region above the intrinsic base region; and an extrinsic base region contacting the intrinsic base region.

Abstract: Structures for a bipolar junction transistor and methods of forming a structure for a bipolar junction transistor. The structure includes a first terminal having a first raised semiconductor layer on a semiconductor substrate, a second terminal having a second raised semiconductor layer on the semiconductor substrate, and an intrinsic base on the semiconductor substrate. The intrinsic base is positioned in a lateral direction between the first raised semiconductor layer of the first terminal and the second raised semiconductor layer of the second terminal. The intrinsic base includes a portion containing silicon-germanium with a germanium concentration that is graded in the lateral direction.

Abstract: Disclosed are a forksheet semiconductor structure and a method of forming the structure. The structure can include a dielectric body with a first sidewall and a second sidewall opposite the first sidewall. The structure can include a first transistor, which incorporates first semiconductor nanosheet(s) positioned laterally immediately adjacent to the first sidewall of the dielectric body, and a second transistor, which incorporates second semiconductor nanosheet(s) positioned laterally immediately adjacent to the second sidewall. The first transistor and the second transistor can both be bipolar junction transistors (BJTs) (e.g., PNP-type BJTs, NPN-type BJTs or a PNP-type BJT and an NPN-type BJT). Alternatively, the first transistor can be a BJT (e.g., a PNP-type BJT or an NPN-type BJT) and the second transistor can be a field effect transistor (FET) (e.g., an N-type FET (NFET) or a P-type FET (PFET)).

Abstract: A structure includes a semiconductor fin on a substrate. A first fin transistor (finFET) is on the substrate, and a second finFET is on the substrate adjacent the first finFET. The first finFET and the second finFET include respective pairs of source/drain regions with each including a first dopant of a first polarity. An electrical isolation structure is in the semiconductor fin between one of the source/drain regions of the first finFET and one of the source/drain regions for the second FinFET, the electrical isolation structure including a second dopant of an opposing, second polarity. The electrical isolation structure extends to an upper surface of the semiconductor fin. A related method is also disclosed.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to annular bipolar transistors and methods of manufacture.

Abstract: Structures for a bipolar junction transistor and methods of fabricating a structure for a bipolar junction transistor. The structure includes an emitter and a collector comprised of a first two-dimensional material having a first conductivity type, and an intrinsic base comprised of a second two-dimensional material having a second conductivity type different than the first conductivity type. The intrinsic base is laterally positioned between the emitter and the collector.

Abstract: A non-uniform base width bipolar junction transistor (BJT) device includes: a semiconductor substrate, the semiconductor substrate having an upper surface; and a BJT device, the BJT device comprising a collector region, a base region, and an emitter region positioned in the semiconductor substrate, the base region being positioned between the collector region and the emitter region; the base region comprising a top surface and a bottom surface, wherein a first width of the top surface of the base region in a base width direction of the BJT device is greater than a second width of the bottom surface of the base region in the base width direction of the BJT device.

Abstract: A structure includes a semiconductor fin on a substrate. A first fin transistor (finFET) is on the substrate, and a second finFET is on the substrate adjacent the first finFET. The first finFET and the second finFET include respective pairs of source/drain regions with each including a first dopant of a first polarity. An electrical isolation structure is in the semiconductor fin between one of the source/drain regions of the first finFET and one of the source/drain regions for the second FinFET, the electrical isolation structure including a second dopant of an opposing, second polarity. The electrical isolation structure extends to an upper surface of the semiconductor fin. A related method is also disclosed.

Abstract: A lateral bipolar junction transistor (BJT) device includes: an emitter region, a collector region, and a base region, the base region positioned between and laterally separating the emitter region and the collector region, the base region including an intrinsic base region; and a cavity formed in a semiconductor substrate and filled with an insulating material, the cavity physically separating a lower surface of the intrinsic base region from the semiconductor substrate.

Abstract: A lateral bipolar junction transistor (BJT) device includes: an emitter region, a collector region, and a base region, the base region positioned between and laterally separating the emitter region and the collector region, the base region including an intrinsic base region; and a cavity formed in a semiconductor substrate and filled with an insulating material, the cavity physically separating a lower surface of the intrinsic base region from the semiconductor substrate.

Abstract: A non-uniform base width bipolar junction transistor (BJT) device includes: a semiconductor substrate, the semiconductor substrate having an upper surface; and a BJT device, the BJT device comprising a collector region, a base region, and an emitter region positioned in the semiconductor substrate, the base region being positioned between the collector region and the emitter region; the base region comprising a top surface and a bottom surface, wherein a first width of the top surface of the base region in a base width direction of the BJT device is greater than a second width of the bottom surface of the base region in the base width direction of the BJT device.

Abstract: One illustrative transistor of a first dopant type disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. The device also includes a counter-doped epitaxial semiconductor material positioned proximate a bottom of each of the first and second overall epitaxial cavities, wherein the counter-doped epitaxial semiconductor material is doped with a second dopant type that is opposite to the first dopant type, and a same-doped epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities above the counter-doped epitaxial semiconductor material, wherein the same-doped epitaxial semiconductor material is doped with a dopant of the first dopant type.

Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to dual trench isolation structures and methods of manufacture. The structure includes: a doped well region in a substrate; a dual trench isolation region within the doped well region, the dual trench isolation region comprising a first isolation region of a first depth and a second isolation region of a second depth, different than the first depth; and a gate structure on the substrate and extending over a portion of the dual trench isolation region.

Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. In one embodiment, each of the first and second overall epitaxial cavities includes a substantially vertically oriented upper epitaxial cavity and a lower epitaxial cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower epitaxial cavity. A lateral width of the lower epitaxial cavity is greater than a lateral width of the upper epitaxial cavity. The device also includes epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities.

Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall cavities formed in the semiconductor substrate on opposite sides of the gate structure. In this example, each of the first and second overall cavities comprise a substantially vertically oriented upper epitaxial cavity and a lower insulation cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower insulation cavity. The transistor also includes an insulation material positioned in at least a portion of the lower insulation cavity of each of the first and second overall cavities and epitaxial semiconductor material positioned in at least the substantially vertically oriented upper epitaxial cavity of each of the first and second overall cavities.

Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to dual trench isolation structures and methods of manufacture. The structure includes: a doped well region in a substrate; a dual trench isolation region within the doped well region, the dual trench isolation region comprising a first isolation region of a first depth and a second isolation region of a second depth, different than the first depth; and a gate structure on the substrate and extending over a portion of the dual trench isolation region.

Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall cavities formed in the semiconductor substrate on opposite sides of the gate structure. In this example, each of the first and second overall cavities comprise a substantially vertically oriented upper epitaxial cavity and a lower insulation cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower insulation cavity. The transistor also includes an insulation material positioned in at least a portion of the lower insulation cavity of each of the first and second overall cavities and epitaxial semiconductor material positioned in at least the substantially vertically oriented upper epitaxial cavity of each of the first and second overall cavities.

Abstract: One illustrative transistor of a first dopant type disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. The device also includes a counter-doped epitaxial semiconductor material positioned proximate a bottom of each of the first and second overall epitaxial cavities, wherein the counter-doped epitaxial semiconductor material is doped with a second dopant type that is opposite to the first dopant type, and a same-doped epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities above the counter-doped epitaxial semiconductor material, wherein the same-doped epitaxial semiconductor material is doped with a dopant of the first dopant type.

Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. In one embodiment, each of the first and second overall epitaxial cavities includes a substantially vertically oriented upper epitaxial cavity and a lower epitaxial cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower epitaxial cavity. A lateral width of the lower epitaxial cavity is greater than a lateral width of the upper epitaxial cavity. The device also includes epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities.