Abstract: An improved probe card system includes a probe assembly having a cantilever probe with a contact arm integral with and extending from a distal end of the probe, wherein the contact arm is oriented substantially parallel to a die or other material to be tested. The contact arm may be an elongated tip of the probe configured to contact a bumped pad or other contact on an outer surface of the arm. Inherent cantilever action of the probe may translating to a scrubbing action of the side of a contact arm on a test pad or solder ball. Some embodiments employ two or more probes for Kelvin-type probing, and the contact arm at the end of the probe can incorporate a substantially straight arm or a bent arm to follow the contour of a solder bump.

Abstract: Methods and systems are provided for forming multiple electrical connections using a single probe suitable for semiconductor wafer probing and the parametric measurement of micro-devices. A conventional single-beam physical wafer probe structure can support two closely spaced and electrically independent probe contacts if an insulating sheath overlaid by a conducting outside coaxial sheath is used to provide a second independent probe contact.