Patents by Inventor Arlene V. Layson

Arlene V. Layson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound
    Patent number: 7327017
    Abstract: A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: February 5, 2008
    Assignee: UTAC Thai Limited
    Inventors: Saravuth Sirinorakul, Arlene V. Layson, Somchai Nondhasitthichai, Yee Heong Chua
  • Process of fabricating semiconductor packages using leadframes roughened with chemical etchant
    Patent number: 7205180
    Abstract: A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: April 17, 2007
    Assignee: NS Electronics Bangkok (1993) Ltd.
    Inventors: Saravuth Sirinorakul, Arlene V. Layson, Somchai Nondhasitthichai, Yee Heong Chua
  • Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
    Patent number: 7049683
    Abstract: A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
    Type: Grant
    Filed: July 19, 2003
    Date of Patent: May 23, 2006
    Assignee: NS Electronics Bangkok (1993) Ltd.
    Inventors: Saravuth Sirinorakul, Arlene V. Layson, Somohal Nondhasitthichai, Yee Heong Chua