Abstract: This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.

Abstract: A sensor includes a carrier carrying a light sensor array. The light sensor array has pixels that are each configured to generate an electrical output in response to receiving a light photon. The light sensor array can be included in or on a wafer or can be built in or on a wafer. The sensor also includes electrical conductors through which the pixels electrically communicate with electronics on the carrier. Each of the electrical conductors is at least partially positioned in a recess that extends into the wafer.