Patents by Inventor Armando Manfredi

Armando Manfredi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High quality factor, integrated inductor and production method thereof
    Patent number: 6472257
    Abstract: The integrated inductor comprises a coil of metal which is formed in the second metal level. The coil is supported by a bracket extending above spaced from a semiconductor material body by an air gap obtained by removing a sacrificial region formed in the first metal level. The bracket is carried by the semiconductor material body through support regions which are arranged peripherally on the bracket and are separated from one another by through apertures which are connected to the air gap. A thick oxide region extends above the semiconductor material body, below the air gap, to reduce the capacitive coupling between the inductor and the semiconductor material body. The inductor thus has a high quality factor, and is produced by a process compatible with present microelectronics processes.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: October 29, 2002
    Assignee: STMicroelectronics S.r.l.
    Inventors: Paolo Ferrari, Armando Manfredi, Benedetto Vigna
  • High quality factor, integrated inductor and production method thereof
    Patent number: 6437418
    Abstract: The integrated inductor comprises a coil of metal which is formed in the second metal level. The coil is supported by a bracket extending above spaced from a semiconductor material body by an air gap obtained by removing a sacrificial region formed in the first metal level. The bracket is carried by the semiconductor material body through support regions which are arranged peripherally on the bracket and are separated from one another by through apertures which are connected to the air gap. A thick oxide region extends above the semiconductor material body, below the air gap, to reduce the capacitive coupling between the inductor and the semiconductor material body. The inductor thus has a high quality factor, and is produced by a process compatible with present microelectronics processes.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: August 20, 2002
    Assignee: STMicroelectronics S.r.l.
    Inventors: Paolo Ferrari, Armando Manfredi, Benedetto Vigna
  • High quality factor, integrated inductor and production method thereof
    Publication number: 20020011653
    Abstract: The integrated inductor comprises a coil of metal which is formed in the second metal level. The coil is supported by a bracket extending above spaced from a semiconductor material body by an air gap obtained by removing a sacrificial region formed in the first metal level. The bracket is carried by the semiconductor material body through support regions which are arranged peripherally on the bracket and are separated from one another by through apertures which are connected to the air gap. A thick oxide region extends above the semiconductor material body, below the air gap, to reduce the capacitive coupling between the inductor and the semiconductor material body. The inductor thus has a high quality factor, and is produced by a process compatible with present microelectronics processes.
    Type: Application
    Filed: September 13, 2001
    Publication date: January 31, 2002
    Inventors: Paolo Ferrari, Armando Manfredi, Benedetto Vigna