Patents by Inventor Armin Grundmann

Armin Grundmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11906579
    Abstract: A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: February 20, 2024
    Assignee: JENOPTIK GmbH
    Inventors: Tobias Gnausch, Armin Grundmann, Thomas Kaden, Norik Janunts, Robert Buettner, Christian Karras
  • Publication number: 20230296668
    Abstract: A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.
    Type: Application
    Filed: January 27, 2021
    Publication date: September 21, 2023
    Inventors: Robert BUETTNER, Armin GRUNDMANN, Tobias GNAUSCH, Thomas KADEN, Stefan FRANZ, Christian KARRAS
  • Publication number: 20230288475
    Abstract: A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt); and an electronic module, which has an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.
    Type: Application
    Filed: January 27, 2021
    Publication date: September 14, 2023
    Inventors: Robert BUETTNER, Armin GRUNDMANN, Tobias GNAUSCH, Thomas KADEN, Stefan FRANZ, Christian KARRAS
  • Publication number: 20220397602
    Abstract: A method for the testing of optoelectronic chips which are arranged on a wafer and have electrical interfaces in the form of contact pads and optical interfaces which are arranged to be fixed relative thereto in the form of optical deflection elements, e.g., grating couplers, with a specific coupling angle. The wafer is adjusted in three adjustment steps with one of the chips relative to a contacting module such that the electrical interfaces of the chip and contacting module contact one another, and the optical interfaces of the chip and contacting module occupy a maximum position of the optical coupling.
    Type: Application
    Filed: June 19, 2020
    Publication date: December 15, 2022
    Inventors: Tobias GNAUSCH, Armin GRUNDMANN, Thomas KADEN, Norik JANUNTS, Robert BUETTNER, Christian KARRAS
  • Patent number: 11480495
    Abstract: The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: October 25, 2022
    Assignee: JENOPTIK Optical Systems GmbH
    Inventors: Tobias Gnausch, Robert Buettner, Thomas Kaden, Thomas Juhasz, Armin Grundmann, Thilo Von Freyhold
  • Publication number: 20200378865
    Abstract: The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.
    Type: Application
    Filed: July 13, 2018
    Publication date: December 3, 2020
    Inventors: Tobias GNAUSCH, Robert BUETTNER, Thomas KADEN, Thomas JUHASZ, Armin GRUNDMANN, Thilo VON FREYHOLD
  • Patent number: 8519494
    Abstract: A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: August 27, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Torsten Kramer, Marcus Ahles, Armin Grundmann, Kathrin Knese, Hubert Benzel, Gregor Schuermann, Simon Armbruster
  • Publication number: 20110147864
    Abstract: A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity.
    Type: Application
    Filed: April 21, 2009
    Publication date: June 23, 2011
    Inventors: Torsten Kramer, Marcus Ahles, Armin Grundmann, Kathrin Knese, Hubert Benzel, Gregor Schuermann, Simon Armbruster
  • Publication number: 20080027475
    Abstract: A puncturing device for generating a puncturing wound for obtaining a body fluid sample of a human or animal, comprising a puncturing element drive in order to drive a puncturing element that is inserted into the puncturing device, an alternating voltage source designed to apply an alternating voltage signal with a rectangular leading edge to an electrode that is integrated into the puncturing element, an electrical measuring facility configured to measure a response signal elicited by applying the alternating voltage signal to the electrode, and an analytical facility configured to analyze the response signal and to control the puncturing element drive based upon a result of the analysis.
    Type: Application
    Filed: February 2, 2007
    Publication date: January 31, 2008
    Applicant: ROCHE DIAGNOSTICS GMBH
    Inventor: Armin Grundmann