Abstract: A method of forming a trench can be used in the fabrication of dynamic random access memory (DRAM) cells. In one aspect, a first layer of a first material (e.g., polysilicon) is formed over a semiconductor region (e.g., a silicon substrate). The first layer is patterned to remove portions of the first material. A second material (e.g., oxide) can then be deposited to fill the portions where the first material was removed. After removing the remaining portions of the first layer of first material, a trench can be etched in the semiconductor region. The trench would be substantially aligned to the second material.

Abstract: A multi-level signal line architecture having signal line pairs employing vertical twists to reduce couplings noise is disclosed. The signal line pairs are provided with open regions to accommodate offsets of twists of adjacent signal line pairs, thus reducing the line pitch of the signal lines. The open region is formed by removing a portion of the signal line in the upper level and locating that portion on another level above the upper level.

Abstract: A sense amplifier for use with a dynamic random access memory is formed in a silicon integrated circuit. The pitch of an array of such sense amplifiers is equal to the pitch of pairs of bit lines of a memory array. Each array of sense amplifiers is formed from four rows of transistors of a given n or p-channel type Metal Oxide Semiconductor (MOS) transistor having a U-shaped gate electrode. The gate electrode of the transistors in each row of transistors of the sense amplifier is offset from those in a previous row by a preselected amount. The bit lines passing through the sense amplifier are straight, with no offsets to affect photolithographic performance, and no protuberances to increase the capacitance of the bit lines. Such an array of sense amplifiers has a size equivalent to the minimum size of the pairs of bit lines, and thus does not cause any increase in the width of the array of memory cells.

Abstract: A method of forming a trench can be used in the fabrication of dynamic random access memory (DRAM) cells. In one aspect, a first layer of a first material (e.g., polysilicon) is formed over a semiconductor region (e.g., a silicon substrate). The first layer is patterned to remove portions of the first material. A second material (e.g., oxide) can then be deposited to fill the portions where the first material was removed. After removing the remaining portions of the first layer of first material, a trench can be etched in the semiconductor region. The trench would be substantially aligned to the second material.

Abstract: A method to optimize the size and filling of decoupling capacitors for very large scale integrated circuits (VLSI) using existing lithographic fillers. The method combines the automatic or manual generation of lithographic fill patterns with the forming of the capacitors. According to the method, when the chip layout is about to be finished, all remaining empty space on the chip gets identified by a layout tool. Then, the closest power-supply nets get extracted. All power supplies and their combinations are sorted in a connection table which determines the appropriate types of capacitances once the power-supply nets closest to the empty spaces extracted from the layout. The empty spaces are then assigned appropriate decoupling capacitances. Decoupling capacitors generated by the method are suitable for VLSI power supplies for noise reduction.

Abstract: A method to optimize the size and filling of decoupling capacitors for very large scale integrated circuits (VLSI) using existing lithographic fillers. The method combines the automatic or manual generation of lithographic fill patterns with the forming of the capacitors. According to the method, when the chip layout is about to be finished, all remaining empty space on the chip gets identified by a layout tool. Then, the closest power-supply nets get extracted. All power supplies and their combinations are sorted in a connection table which determines the appropriate types of capacitances once the power-supply nets closest to the empty spaces extracted from the layout. The empty spaces are then assigned appropriate decoupling capacitances. Decoupling capacitors generated by the method are suitable for VLSI power supplies for noise reduction.