Patents by Inventor Armin Scharping

Armin Scharping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component
    Patent number: 8901684
    Abstract: A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: December 2, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT, CORRESPONDING COMPOSITE COMPONENT, AND CORRESPONDING MICROMECHANICAL COMPONENT
    Publication number: 20130001711
    Abstract: A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.
    Type: Application
    Filed: June 5, 2012
    Publication date: January 3, 2013
    Inventors: Hubert BENZEL, Frank Henning, Armin Scharping, Christoph Schelling
  • Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component
    Patent number: 8232126
    Abstract: A manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component are described.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: July 31, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component
    Publication number: 20110163396
    Abstract: The present invention relates to a manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component.
    Type: Application
    Filed: April 21, 2009
    Publication date: July 7, 2011
    Applicant: ROBERT BOSCH GMBH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • Carrier device for magnetizable substrate
    Publication number: 20060238286
    Abstract: A carrier device for magnetizable substrates, such as stainless steel substrates, which is suitable for processing thin-film substrates in particular. The carrier device includes at least one magnetized base element having at least one receptacle for a substrate.
    Type: Application
    Filed: July 7, 2004
    Publication date: October 26, 2006
    Inventors: Ralf Henn, Armin Scharping