Abstract: An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO.sub.2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO.sub.2 in pre-hardening storage of the resin.