Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

Abstract: Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging.

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

Abstract: A cursor in a viewable portion of a webpage, or pan region, visually encounters a friction field when the cursor enters a margin of the viewable portion. As a user moves the cursor into the margin of the viewable portion, the movement of the displayed position of the cursor is limited as if the cursor is being restricted by a friction field in the margin. Also, as the cursor enters the margin of the viewable portion of the webpage, the webpage scrolls in the opposite direction of movement of the cursor. The amount of scroll of the webpage is proportional to a distance the cursor is away from an inner edge of the margin. When a user no longer attempts to move the cursor in the margin, the cursor fluidly drifts back toward a center of the viewable portion and so that scrolling of the webpage pauses.

Abstract: In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging.

Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device.

Abstract: A method is implemented by a network device for improving availability of network component using multi-chassis redundancy by efficiently re-routing data traffic intended for the network component in the event of a link or node failure. The network device is in a set of network devices hosting the network component each network device in the set of network devices having a shared cluster identifier and a separate node identifier. The set of network devices hosting the network component share a virtual internet protocol address.

Abstract: Methods, systems, and apparatuses that assist with cooling semiconductor packages, such as multi-chip packages (MCPs) are described. A semiconductor package includes a component on a substrate. The component can include one or more semiconductor dies. The package can also include a multi-reference integrated heat spreader (IHS) solution (also referred to as a smart IHS solution), where the smart IHS solution includes a smart IHS lid. The smart IHS lid includes a cavity formed in a central region of the smart lid. The smart IHS lid can be on the component, such that the cavity corresponds to the component. A first thermal interface material layer (TIM-layer 1) can be on the component. An individual IHS lid (IHS slug) can be on the TIM-layer 1. The IHS slug can be inserted into the cavity. Furthermore, an intermediate thermal interface material layer (TIM-1A layer) can be between the IHS slug and the cavity.

Abstract: Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.

Abstract: Multi-stage cursor control techniques are described herein in which a control algorithm having multiple stages is applied to facilitate fine grained control over cursor movement and positioning. In one or more implementations, monitoring is performed to detect input provided via a controller for a computing device to manipulate a cursor within a user interface for an application. When input is detected, a multi-stage damping algorithm is applied to the detected input. The multi-stage damping algorithm may include both spatial and temporal dampening factors. Movement of the cursor is rendered in accordance with the damped input determined via application of the algorithm. Then, when input to manipulate the cursor is concluded, an attraction sequence is initiated to move the cursor to a target element contained in the user interface.

Abstract: Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.

Abstract: Methods, systems, and apparatuses that assist with cooling semiconductor packages, such as multi-chip packages (MCPs) are described. A semiconductor package includes a component on a substrate. The component can include one or more semiconductor dies. The package can also include a multi-reference integrated heat spreader (IHS) solution (also referred to as a smart IHS solution), where the smart IHS solution includes a smart IHS lid. The smart IHS lid includes a cavity formed in a central region of the smart lid. The smart IHS lid can be on the component, such that the cavity corresponds to the component. A first thermal interface material layer (TIM-layer 1) can be on the component. An individual IHS lid (IHS slug) can be on the TIM-layer 1. The IHS slug can be inserted into the cavity. Furthermore, an intermediate thermal interface material layer (TIM-1A layer) can be between the IHS slug and the cavity.

Abstract: A thermal management solution may be provided for a microelectronic system, wherein a jumping drops vapor chamber is utilized between at least one microelectronic device and an integrated heat spreader. The microelectronic system may comprise a microelectronic device attached by an active surface thereof to a microelectronic substrate. The integrated heat spreader, having a first surface and an opposing second surface, is also attached to the microelectronic substrate with a jumping drops vapor chamber disposed between a back surface of the microelectronic device and the integrated heat spreader second surface. The jumping drops vapor chamber may comprise a vapor space defined by a hydrophilic evaporation surface on the microelectronic device back surface, a hydrophobic condensation surface on the integrated heat spreader second surface, and at least one sidewall extending between the hydrophilic evaporation surface and the hydrophobic condensation surface with a working fluid disposed within the vapor space.

Abstract: A method is implemented by a network device for improving availability of network component using multi-chassis redundancy by efficiently re-routing data traffic intended for the network component in the event of a link or node failure. The network device is in a set of network devices hosting the network component each network device in the set of network devices having a shared cluster identifier and a separate node identifier. The set of network devices hosting the network component share a virtual internet protocol address.

Abstract: An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.

Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.

Abstract: Multi-stage cursor control techniques are described herein in which a control algorithm having multiple stages is applied to facilitate fine grained control over cursor movement and positioning. In one or more implementations, monitoring is performed to detect input provided via a controller for a computing device to manipulate a cursor within a user interface for an application. When input is detected, a multi-stage damping algorithm is applied to the detected input. The multi-stage damping algorithm may include both spatial and temporal dampening factors. Movement of the cursor is rendered in accordance with the damped input determined via application of the algorithm. Then, when input to manipulate the cursor is concluded, an attraction sequence is initiated to move the cursor to a target element contained in the user interface.

Abstract: A cursor in a viewable portion of a webpage, or pan region, visually encounters a friction field when the cursor enters a margin of the viewable portion. As a user moves the cursor into the margin of the viewable portion, the movement of the displayed position of the cursor is limited as if the cursor is being restricted by a friction field in the margin. Also, as the cursor enters the margin of the viewable portion of the webpage, the webpage scrolls in the opposite direction of movement of the cursor. The amount of scroll of the webpage is proportional to a distance the cursor is away from an inner edge of the margin. When a user no longer attempts to move the cursor in the margin, the cursor fluidly drifts back toward a center of the viewable portion and so that scrolling of the webpage pauses.