Abstract: Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, and a radiation shield around the radiation source. The radiation shield includes a wall secured to the support structure, a vacuum bag on the wall, where the vacuum bag has an inside air pressure less than an air pressure outside the vacuum bag, and a lid. The air pressure inside the vacuum bag is less than the atmospheric pressure outside the vacuum bag. When the vacuum is created in the vacuum bag, the vacuum bag deforms and compresses to help provide a vacuum-based mechanical loading that helps to create an applied load on the one or more radiation sources by the lid.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

Abstract: Devices and systems for cooling using piezoelectricity are disclosed herein. In one example, a device includes a heat pipe, one or more fins thermally coupled to a first end of the heat pipe, where the fins extend laterally from the heat pipe, and one or more piezoelectric structures coupled to the fins.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.

Abstract: In one embodiment, a blower apparatus includes a housing defining an inlet opening and an outlet opening. The blower apparatus also includes a fan within the housing and a porous material coupled to the housing. The porous material is disposed over at least a portion of the inlet opening of the housing.

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

Abstract: In one embodiment, a blower apparatus includes a housing defining an inlet opening and an outlet opening. The blower apparatus also includes a fan within the housing and a porous material coupled to the housing. The porous material is disposed over at least a portion of the inlet opening of the housing.

Abstract: A fan impeller, including: a hub; an annular structure positioned radially outward of the hub and defining a peripheral surface lying in a first plane; and a plurality of blades extending radially between the hub and the annular structure, each blade having a main surface lying in a second plane that is perpendicular to the first plane, wherein each of the plurality of blades includes an edge region proximate the annular structure, the edge region tapering to define an inclination angle between a top edge and a bottom edge of the blade, the inclination angle being configured to reduce turbulence during operation. Each of the plurality of blades may additionally define a slot formed through the main surface of the blade, the slot being configured to interrupt turbulent boundary layer growth towards a trailing edge of the respective blade.

Abstract: Heat exchangers on edges of circuit boards are disclosed. An apparatus includes: a housing including an outlet for air flow; a circuit board; and a heat exchanger extending along an edge of the circuit board. The heat exchanger includes a first side and a second side opposite the first side. The first side faces away from the outlet, and the second side faces toward the outlet. The edge of the circuit board is closer to the second side of the heat exchanger than the edge is to the first side of the heat exchanger.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: An apparatus for reducing air turbulence in a fan chassis. The chassis including a cutwater extending from a base of the chassis in a continuous or stepwise manner. Wherein a portion of the cutwater extends at one or more acute angles to an axis orthogonal to the base or an axis of an impeller mount of the chassis. Wherein the cutwater may include an aperture or recess that extends from a proximal portion of the cutwater to a distal portion of the cutwater.

Abstract: Methods and apparatus to control airflow in foldable computing devices are disclosed. A disclosed apparatus for use with a foldable computing device includes a barrier carried by at least one of a first folding portion or a second folding portion of the computing device, the first folding portion rotatable relative to the second folding portion, and an actuator to move the barrier in response to a rotation between the first and second folding portions to reduce a flow of air into the foldable computing device.

Abstract: Heat dissipation systems, apparatus, articles of manufacture, and methods are disclosed. An example computing device includes a display, a keyboard, processor circuitry, and a dual-phase heat dissipation system. The dual-phase dissipation system includes a housing defining a chamber, a fluid inlet, and a fluid outlet. The chamber receives a working fluid via the fluid inlet. A pump fluidly couples to the fluid inlet and the fluid outlet of the housing. The pump is to receive the working fluid via the fluid outlet of the housing and increase at least one of a flow rate or volume of the working fluid at the fluid inlet.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: Thermal management systems for electronic devices and related methods are disclosed. An example electronic device includes a chassis including a first cover and a second cover, the first cover including an upper surface and a plurality of side walls and the second cover including a lower surface of the chassis, the first cover and the second cover defining an internal cavity of the chassis, the first cover including a first device inlet formed in a first side wall of the first cover; a fan positioned in the internal cavity, the fan including a first fan inlet and a second fan inlet opposite the first fan inlet; and a side channel positioned between the first device inlet and the first fan inlet to direct fluid flow between the first device inlet and the first fan inlet.

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce fan-induced vibration in electronic devices are disclosed. An example electronic device includes a mainboard; a fan; a chassis including a first cover and a second cover; and at least two of: (a) a fastener to couple the fan to the chassis; and a first dampener positioned between both (1) the fan and the fastener and (2) the fan and the chassis; (b) a plurality of check valves orientated in a first direction; and a plurality of inversed check valves oriented in a second direction different than the first direction, the inverse check valves to change a flow rate of air exhausted from the fan; or (c) a first plurality of second dampeners coupled between the mainboard and the first cover; and a second plurality of second dampeners coupled between the mainboard and the second cover.

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.

Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.