Patents by Inventor Arnaud Concord

Arnaud Concord has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input
    Patent number: 8916267
    Abstract: An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material. The particles of the expansion material are at least partially encapsulated. A bond of at least two components and an adhesive layer includes an adhesive composition based on adhesive matrices and expansion material. The bonded components may include metal, plastic, wood, glass, natural or synthetic materials or a composite material thereof.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: December 23, 2014
    Assignees: EADS Deutschland GmbH, Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung E.V.
    Inventors: Monika Bauer, Arnaud Concord, Eike Langkabel, Hans Luinge, Georg Wachinger
  • Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input
    Patent number: 8377245
    Abstract: An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material, the particles of the expansion material being at least partially encapsulated.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: February 19, 2013
    Assignees: EADS Deutschland GmbH, Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung E.V.
    Inventors: Monika Bauer, Arnaud Concord, Eike Langkabel, Hans Luinge, Georg Wachinger
  • ADHESIVE COMPOSITION FOR DETACHABLE ADHESIVE BONDS AND MODIFICATION OF THE ENCAPSULATION MATERIALS FOR A PURPOSEFUL ENERGY INPUT
    Publication number: 20120114952
    Abstract: An adhesive composition for detachable adhesive bonds is based on adhesive matrices and expansion material, the particles of the expansion material being at least partially encapsulated.
    Type: Application
    Filed: November 3, 2011
    Publication date: May 10, 2012
    Applicants: Fraunhofer Gesellschaft Zur Forderung Der Angewandten Forschung E.V., EADS DEUTSCHLAND GMBH
    Inventors: Monika Bauer, Arnaud Concord, Eike Langkabel, Hans Luinge, Georg Wachinger