Abstract: A method for manufacturing an insulation product including mineral fibers or natural organic fibers bound by an organic binder, the method including (a) applying a sizing composition to the mineral fibers or the natural organic fibers, (b) forming an assembly of the mineral fibers or the natural organic fibers, (c) heating the assembly of the mineral fibers or the natural organic fibers until the sizing composition has cured, wherein the sizing composition includes at least one lignin, which is potentially oxidized, and at least one non-polymeric polycarboxylic organic acid.

Abstract: A process for the manufacture of lignocellulosic fiber-based insulation boards that includes: applying a binder composition to lignocellulosic fibers; forming a lignocellulosic fiber mat by compressing the lignocellulosic fibers impregnated with the binder composition; and heating the compressed lignocellulosic fiber mat so as to obtain a lignocellulosic fiberboard bound by an insoluble and infusible thermoset binder, where the binder composition is an emulsion of a poly(methylene diphenyl isocyanate) (pMDI) in an aqueous phase comprising water and a polyol in dissolved form.

Abstract: In order to carry out the encapsulation of electronic components, the invention proposes to cover the electronic components (7) with a heat-polymerisable material corresponding to a composition comprising a diimide constituent and a diamine constituent, in which the diimide constituent has been predissolved in the diamine constituent, and to heat the assembly obtained under conditions suitable for carrying out the curing of the material by an addition polymerization reaction between said diimide constituent and the diamine constituent. The invention finds an application in particular in the field of electronic power modules.

Abstract: In order to carry out the encapsulation of electronic components, the invention proposes to cover the electronic components (7) with a heat-polymerisable material corresponding to a composition comprising a diimide constituent and a diamine constituent, in which the diimide constituent has been predissolved in the diamine constituent, and to heat the assembly obtained under conditions suitable for carrying out the curing of the material by an addition polymerisation reaction between said diimide constituent and the diamine constituent. The invention finds an application in particular in the field of electronic power modules.