Patents by Inventor Arnaud SOISSON

Arnaud SOISSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250043514
    Abstract: A method for manufacturing an insulation product including mineral fibers or natural organic fibers bound by an organic binder, the method including (a) applying a sizing composition to the mineral fibers or the natural organic fibers, (b) forming an assembly of the mineral fibers or the natural organic fibers, (c) heating the assembly of the mineral fibers or the natural organic fibers until the sizing composition has cured, wherein the sizing composition includes at least one lignin, which is potentially oxidized, and at least one non-polymeric polycarboxylic organic acid.
    Type: Application
    Filed: December 15, 2022
    Publication date: February 6, 2025
    Inventor: Arnaud SOISSON
  • Publication number: 20210164170
    Abstract: A process for the manufacture of lignocellulosic fiber-based insulation boards that includes: applying a binder composition to lignocellulosic fibers; forming a lignocellulosic fiber mat by compressing the lignocellulosic fibers impregnated with the binder composition; and heating the compressed lignocellulosic fiber mat so as to obtain a lignocellulosic fiberboard bound by an insoluble and infusible thermoset binder, where the binder composition is an emulsion of a poly(methylene diphenyl isocyanate) (pMDI) in an aqueous phase comprising water and a polyol in dissolved form.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 3, 2021
    Applicant: SAINT-GOBAIN ISOVER
    Inventor: Arnaud SOISSON
  • Patent number: 10109546
    Abstract: In order to carry out the encapsulation of electronic components, the invention proposes to cover the electronic components (7) with a heat-polymerisable material corresponding to a composition comprising a diimide constituent and a diamine constituent, in which the diimide constituent has been predissolved in the diamine constituent, and to heat the assembly obtained under conditions suitable for carrying out the curing of the material by an addition polymerization reaction between said diimide constituent and the diamine constituent. The invention finds an application in particular in the field of electronic power modules.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: October 23, 2018
    Assignee: Valeo Equipements Electriques Moteur
    Inventors: Arnaud Soisson, Philippe Banet, Linda Chikh, Odile Fichet
  • Publication number: 20170358509
    Abstract: In order to carry out the encapsulation of electronic components, the invention proposes to cover the electronic components (7) with a heat-polymerisable material corresponding to a composition comprising a diimide constituent and a diamine constituent, in which the diimide constituent has been predissolved in the diamine constituent, and to heat the assembly obtained under conditions suitable for carrying out the curing of the material by an addition polymerisation reaction between said diimide constituent and the diamine constituent. The invention finds an application in particular in the field of electronic power modules.
    Type: Application
    Filed: December 1, 2015
    Publication date: December 14, 2017
    Inventors: Arnaud SOISSON, Philippe BANET, Linda CHIKH, Odile FICHET