Abstract: A holographic antenna comprises an optically transparent substrate; a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component; a ground plane arranged on a second surface, opposite the first surface, of the substrate; one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; and control lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups.

Abstract: A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

Abstract: A holographic antenna comprises an optically transparent substrate; a hologram arranged on a first surface of the substrate, the hologram comprising two or more hologram stripes, each having a plurality of linearly arranged hologram pixels, each comprising a switching component; a ground plane arranged on a second surface, opposite the first surface, of the substrate; one or more surface wave launchers arranged on or in a surface of the substrate, the one or more surface wave launchers being configured to feed a feeding signal in a frequency range above 50 GHz into the hologram; and control lines connected to the switching components of the hologram pixels for controlling the hologram pixels individually or in groups.

Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package.

Abstract: A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

Abstract: A synthesizer comprises a two-point modulation phase locked tow, TPM PLL, circuit configured to receive a frequency tuning signal and to generate a stepped chirp signal in an intermediate frequency range by applying a two-point modulation PLL on the frequency tuning signal, and a subsampling PLL circuit configured to receive the stepped chirp signal in a mm-wave frequency range and to generate a smoothened chirp signal in a mm-wave frequency range by applying a subsampling PLL on the stepped chirp signal.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed. The elements can be integrated by a standard pick and place process.

Abstract: A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages.

Abstract: A synthesizer comprises a first two-point modulation phase locked loop, TPM PLL, circuit that receives a first reference clock signal at a first reference frequency and a feedback signal at a feedback frequency and generates a first chirp signal by applying a two-point modulation PLL on the first reference clock signal, a second integer-n TPM PLL circuit that receives a second reference clock signal at a second reference frequency lower than the first reference frequency and generates a second chirp signal by applying a TPM PLL on the second reference clock signal, a mixer that downconverts the first chirp signal by the second chirp signal to obtain the feedback signal at the feedback frequency corresponding to the difference of the frequency of the first chirp signal and the second chirp signal, and a feedback path that feeds back the feedback signal to the first TPM PLL circuit.

Abstract: A planar antenna array comprises two or more linear arrays of radiation elements, said linear arrays being substantially arranged in parallel, a first connecting unit connecting first ends of said two or more linear arrays, a second connecting unit connecting second ends of said two or more linear arrays, and a feed port at least at one end of each one of said first and second connecting units for reception of a feed signal.

Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: A synthesizer comprises a first two-point modulation phase locked loop, TPM PLL, circuit that receives a first reference clock signal at a first reference frequency and a feedback signal at a feedback frequency and generates a first chirp signal by applying a two-point modulation PLL on the first reference clock signal, a second integer-n TPM PLL circuit that receives a second reference clock signal at a second reference frequency lower than the first reference frequency and generates a second chirp signal by applying a TPM PLL on the second reference clock signal, a mixer that downconverts the first chirp signal by the second chirp signal to obtain the feedback signal at the feedback frequency corresponding to the difference of the frequency of the first chirp signal and the second chirp signal, and a feedback path that feeds back the feedback signal to the first TPM PLL circuit.

Abstract: A synthesizer comprises a two-point modulation phase locked tow, TPM PLL, circuit configured to receive a frequency tuning signal and to generate a stepped chirp signal in an intermediate frequency range by applying a two-point modulation PLL on the frequency tuning signal, and a subsampling PLL circuit configured to receive the stepped chirp signal in a mm-wave frequency range and to generate a smoothened chirp signal in a mm-wave frequency range by applying a subsampling PLL on the stepped chirp signal.

Abstract: A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed.

Abstract: A planar antenna array comprises two or more linear arrays of radiation elements, said linear arrays being substantially arranged in parallel, a first connecting unit connecting first ends of said two or more linear arrays, a second connecting unit connecting second ends of said two or more linear arrays, and a feed port at least at one end of each one of said first and second connecting units for reception of a feed signal.

Abstract: A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages.